Satoru Shimizu

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electroless copper plating solution and method for electroless copp...
- Patent number 6,193,789
- Issue date Feb 27, 2001
- Ebara-Udylite Co., Ltd.
- Hideo Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CONDITIONING INSULATING RESIN AND ITS USE
- Publication number 20110064954
- Publication date Mar 17, 2011
- EBARA-UDYLITE CO., LTD.
- Satoru Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE MODIFICATION LIQUID FOR PLASTIC AND METHOD OF METALLIZING P...
- Publication number 20090176022
- Publication date Jul 9, 2009
- Ebara-Udylite Co., Ltd.
- Satoru Shimizu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR