Satoru Tomekawa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure
- Patent number 7,969,741
- Issue date Jun 28, 2011
- Panasonic Corporation
- Haruo Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming bumps and solder bump
- Patent number 7,799,607
- Issue date Sep 21, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate, multilayer flexible substrate
- Patent number 7,773,386
- Issue date Aug 10, 2010
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 7,759,162
- Issue date Jul 20, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 7,752,749
- Issue date Jul 13, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate having interlaminar junctions, and process for p...
- Patent number 7,531,754
- Issue date May 12, 2009
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable information terminal apparatus
- Patent number 7,522,938
- Issue date Apr 21, 2009
- Panasonic Corporation
- Yoshihiro Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible substrate, multilayer flexible substrate and process for p...
- Patent number 7,321,496
- Issue date Jan 22, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate having interlaminar junctions, and process for p...
- Patent number 7,205,483
- Issue date Apr 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable device
- Patent number 7,184,617
- Issue date Feb 27, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tsuguhiro Korenaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Process for manufacturing a circuit board
- Patent number 7,103,971
- Issue date Sep 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and its production process
- Patent number 7,056,571
- Issue date Jun 6, 2006
- Matsushita Electric Industrial Co., Ltd.
- Satoru Tomekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 7,047,629
- Issue date May 23, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 6,996,902
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate having improved connection reliability and a meth...
- Patent number 6,930,395
- Issue date Aug 16, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoru Tomekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin board, manufacturing process for resin board, connection medi...
- Patent number 6,866,892
- Issue date Mar 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and production method thereof
- Patent number 6,774,316
- Issue date Aug 10, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and its manufacture method
- Patent number 6,713,688
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 6,691,409
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,686,029
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin board, manufacturing process for resin board, connection medi...
- Patent number 6,596,381
- Issue date Jul 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,558,780
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production of the same
- Patent number 6,518,514
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20100044100
- Publication date Feb 25, 2010
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20100020497
- Publication date Jan 28, 2010
- Matsushita Electric Industrial Co., Ltd.
- Haruo Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounting Method and Electronic Component Mount...
- Publication number 20090049687
- Publication date Feb 26, 2009
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...
- Publication number 20090032285
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible substrate, multilayer flexible substrate and process for p...
- Publication number 20080210458
- Publication date Sep 4, 2008
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20080185178
- Publication date Aug 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip Mounting Process and Flip Chip Assembly
- Publication number 20080017995
- Publication date Jan 24, 2008
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Forming Bumps and Solder Bump
- Publication number 20070257362
- Publication date Nov 8, 2007
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible substrate having interlaminar junctions, and process for p...
- Publication number 20070151756
- Publication date Jul 5, 2007
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20060283626
- Publication date Dec 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module, process for producing the same, and film inte...
- Publication number 20060091524
- Publication date May 4, 2006
- Seiji Karashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Portable information terminal apparatus
- Publication number 20050281555
- Publication date Dec 22, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoshihiro Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flexible substrate having interlaminar junctions, and process for p...
- Publication number 20050205291
- Publication date Sep 22, 2005
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible substrate, Multilayer flexible substrate and process for p...
- Publication number 20050205294
- Publication date Sep 22, 2005
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Portable device
- Publication number 20050201693
- Publication date Sep 15, 2005
- Tsuguhiro Korenaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20050139384
- Publication date Jun 30, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20050124197
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepreg for printed wiring board, printed wiring board using the pr...
- Publication number 20050014035
- Publication date Jan 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yasushi Nakagiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring board and its production process
- Publication number 20040142154
- Publication date Jul 22, 2004
- Satoru Tomekawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and its manufacture method
- Publication number 20040080918
- Publication date Apr 29, 2004
- MUTSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shinobu Kokufu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production method for conductive paste and production method for pr...
- Publication number 20040020046
- Publication date Feb 5, 2004
- Takeshi Suzuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Resin board, manufacturing process for resin board, connection medi...
- Publication number 20040005443
- Publication date Jan 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030170434
- Publication date Sep 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030157307
- Publication date Aug 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and production of the same
- Publication number 20030066683
- Publication date Apr 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and its manufacture method
- Publication number 20020131248
- Publication date Sep 19, 2002
- Shinobu Kokufu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20020127379
- Publication date Sep 12, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit Substrate and manufacturing method thereof
- Publication number 20020066961
- Publication date Jun 6, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Satoru Tomekawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and production of the same
- Publication number 20020038725
- Publication date Apr 4, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Satoru Tomekawa

Person

Patents Grantslast 30 patents

Flip chip mounting process and flip chip assembly

Substrate structure

Process for forming bumps and solder bump

Flexible substrate, multilayer flexible substrate

Flip chip mounting process and flip chip assembly

Electronic component mounting method and electronic component mount...

Flexible substrate having interlaminar junctions, and process for p...

Portable information terminal apparatus

Flexible substrate, multilayer flexible substrate and process for p...

Flexible substrate having interlaminar junctions, and process for p...

Portable device

Process for manufacturing a circuit board

Wiring board and its production process

Method of manufacturing circuit board

Method for manufacturing a circuit board

Circuit substrate having improved connection reliability and a meth...

Resin board, manufacturing process for resin board, connection medi...

Wiring board and production method thereof

Circuit board and its manufacture method

Method of producing a circuit board

Circuit board and method for manufacturing the same

Resin board, manufacturing process for resin board, connection medi...

Circuit board and method for manufacturing the same

Circuit board and production of the same

Patents Applicationslast 30 patents

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

BOARD STRUCTURE AND ELECTRONIC DEVICE

SUBSTRATE STRUCTURE

Electronic Component Mounting Method and Electronic Component Mount...

MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...

Flexible substrate, multilayer flexible substrate and process for p...

Circuit board and method for manufacturing the same, semiconductor...

Flip Chip Mounting Process and Flip Chip Assembly

Process for Forming Bumps and Solder Bump

Flexible substrate having interlaminar junctions, and process for p...

Resin board, manufacturing process for resin board, connection medi...

Semiconductor module, process for producing the same, and film inte...

Portable information terminal apparatus

Flexible substrate having interlaminar junctions, and process for p...

Flexible substrate, Multilayer flexible substrate and process for p...

Portable device

Resin board, manufacturing process for resin board, connection medi...

Circuit board and method for manufacturing the same, semiconductor...

Prepreg for printed wiring board, printed wiring board using the pr...

Wiring board and its production process

Circuit board and its manufacture method

Production method for conductive paste and production method for pr...

Resin board, manufacturing process for resin board, connection medi...

Circuit board and method for manufacturing the same

Circuit board and method for manufacturing the same

Circuit board and production of the same

Circuit board and its manufacture method

Circuit board and method for manufacturing the same

Circuit Substrate and manufacturing method thereof

Circuit board and production of the same