Satoshi EMOTO

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of determining reinforcement position of circuit substrate a...
- Patent number 9,053,262
- Issue date Jun 9, 2015
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board reinforcing structure, board assembly, and electronic device
- Patent number 8,604,347
- Issue date Dec 10, 2013
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repair apparatus and repair method
- Patent number 8,434,670
- Issue date May 7, 2013
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with kneaded conductive paste
- Patent number 8,314,339
- Issue date Nov 20, 2012
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of semiconductor device
- Patent number 6,787,925
- Issue date Sep 7, 2004
- Fujitsu Limited
- Kazuhisa Tsunoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method of semiconductor device
- Patent number 6,458,237
- Issue date Oct 1, 2002
- Fujitsu Limited
- Kazuhisa Tsunoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multichip package module in which rough-pitch...
- Patent number 6,240,634
- Issue date Jun 5, 2001
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to produce a multichip package module in which rough-pitc...
- Patent number 6,122,823
- Issue date Sep 26, 2000
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multichip package module in which rough-pitch...
- Patent number 6,006,426
- Issue date Dec 28, 1999
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE
- Publication number 20140078700
- Publication date Mar 20, 2014
- Fujitsu Limited
- Takumi MASUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL COMPONENT MANUFACTURING METHOD AND OPTICAL COMPONENT MANUFA...
- Publication number 20140001660
- Publication date Jan 2, 2014
- Toru OKADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20130256022
- Publication date Oct 3, 2013
- Fujitsu Limited
- Hiroshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...
- Publication number 20130128477
- Publication date May 23, 2013
- Hiroshi KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...
- Publication number 20110303450
- Publication date Dec 15, 2011
- Fujitsu Limited
- Toru OKADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD
- Publication number 20110303449
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20110303441
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...
- Publication number 20110303443
- Publication date Dec 15, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE
- Publication number 20110304059
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...
- Publication number 20100326726
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Hisao Tanaka
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100006325
- Publication date Jan 14, 2010
- FUJITSU LIMITED
- Masayuki KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR APPARATUS AND REPAIR METHOD
- Publication number 20090321500
- Publication date Dec 31, 2009
- FUJITSU LIMITED
- Toru OKADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAD ASSEMBLY
- Publication number 20090195933
- Publication date Aug 6, 2009
- Fujitsu Limited
- Takuma Kido
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board, method of forming wiring pattern, and method of manu...
- Publication number 20090044972
- Publication date Feb 19, 2009
- FUJITSU LIMITED OF Kawasaki, Japan
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting method of semiconductor device
- Publication number 20010011774
- Publication date Aug 9, 2001
- FUJITSU LIMITED
- Kazuhisa Tsunoi
- H01 - BASIC ELECTRIC ELEMENTS

Satoshi EMOTO

Person

Patents Grantslast 30 patents

Method of determining reinforcement position of circuit substrate a...

Board reinforcing structure, board assembly, and electronic device

Repair apparatus and repair method

Circuit board with kneaded conductive paste

Mounting method of semiconductor device

Mounting method of semiconductor device

Method of producing a multichip package module in which rough-pitch...

Apparatus to produce a multichip package module in which rough-pitc...

Method of producing a multichip package module in which rough-pitch...

Patents Applicationslast 30 patents

CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE

OPTICAL COMPONENT MANUFACTURING METHOD AND OPTICAL COMPONENT MANUFA...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...

MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...

PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD

BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE

MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...

CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE

SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...

PRINTED WIRING BOARD

REPAIR APPARATUS AND REPAIR METHOD

HEAD ASSEMBLY

Circuit board, method of forming wiring pattern, and method of manu...

Mounting method of semiconductor device