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Satoshi Enokido

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Conveying device
    • Patent number 12,217,996
    • Issue date Feb 4, 2025
    • Shinkawa Ltd.
    • Jin Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus and wire bonding method
    • Patent number 10,262,968
    • Issue date Apr 16, 2019
    • Shinkawa Ltd.
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding program
    • Patent number 7,330,582
    • Issue date Feb 12, 2008
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding pattern discrimination device
    • Patent number 7,324,683
    • Issue date Jan 29, 2008
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,324,684
    • Issue date Jan 29, 2008
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding pattern discrimination program
    • Patent number 7,321,681
    • Issue date Jan 22, 2008
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding pattern discrimination method, bonding pattern discriminati...
    • Patent number 7,224,829
    • Issue date May 29, 2007
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding method, bonding apparatus and bonding program
    • Patent number 7,209,583
    • Issue date Apr 24, 2007
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,814,121
    • Issue date Nov 9, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Offset measurement method, tool position detection method and bondi...
    • Patent number 6,762,848
    • Issue date Jul 13, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,467,673
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,464,126
    • Issue date Oct 15, 2002
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Workpiece conveying apparatus used with workpiece inspection device
    • Patent number 5,772,040
    • Issue date Jun 30, 1998
    • Kabushiki Kaisha Shinkawa
    • Hiromi Tomiyama
    • B07 - SEPARATING SOLIDS FROM SOLIDS SORTING

Patents Applicationslast 30 patents

  • Information Patent Application

    CONVEYING DEVICE
    • Publication number 20220216089
    • Publication date Jul 7, 2022
    • SHINKAWA LTD.
    • JIN LI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BONDING APPARATUS AND WIRE BONDING METHOD
    • Publication number 20180090464
    • Publication date Mar 29, 2018
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for setting capillary contact position data and wire bonding...
    • Publication number 20070181651
    • Publication date Aug 9, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Kuniyuki Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding program
    • Publication number 20070041632
    • Publication date Feb 22, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding pattern discrimination program
    • Publication number 20070036423
    • Publication date Feb 15, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20070036425
    • Publication date Feb 15, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding pattern discrimination device
    • Publication number 20070036424
    • Publication date Feb 15, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding method, bonding apparatus and bonding program
    • Publication number 20050167471
    • Publication date Aug 4, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding pattern discrimination method, bonding pattern discriminati...
    • Publication number 20050167470
    • Publication date Aug 4, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030030821
    • Publication date Feb 13, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Offset measurement method, tool position detection method and bondi...
    • Publication number 20010042770
    • Publication date Nov 22, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010016062
    • Publication date Aug 23, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010011669
    • Publication date Aug 9, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS