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Satoshi Genda

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing workpiece
    • Patent number 11,433,487
    • Issue date Sep 6, 2022
    • Disco Corporation
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,530,695
    • Issue date Dec 27, 2016
    • Disco Corporation
    • Tsutomu Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Fabrication method for device having die attach film on the back si...
    • Patent number 7,915,140
    • Issue date Mar 29, 2011
    • Disco Corporation
    • Satoshi Genda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser beam processing machine
    • Patent number 7,642,485
    • Issue date Jan 5, 2010
    • Disco Corporation
    • Noboru Takeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer holding mechanism
    • Patent number 7,557,904
    • Issue date Jul 7, 2009
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method for wafer
    • Patent number 7,544,588
    • Issue date Jun 9, 2009
    • Disco Corporation
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer dividing method
    • Patent number 7,459,378
    • Issue date Dec 2, 2008
    • Disco Corporation
    • Satoshi Genda
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,179,723
    • Issue date Feb 20, 2007
    • Disco Corporation
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of dividing a workpiece in the form of a plate having a laye...
    • Patent number 7,087,857
    • Issue date Aug 8, 2006
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER MANUFACTURING METHOD
    • Publication number 20230321871
    • Publication date Oct 12, 2023
    • Disco Corporation
    • Kazuya HIRATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUC...
    • Publication number 20230249311
    • Publication date Aug 10, 2023
    • Disco Corporation
    • Satoshi GENDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FACET REGION DETECTION METHOD AND WAFER GENERATION METHOD
    • Publication number 20220410305
    • Publication date Dec 29, 2022
    • Disco Corporation
    • Satoshi GENDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20200215649
    • Publication date Jul 9, 2020
    • Disco Corporation
    • Satoshi GENDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150096964
    • Publication date Apr 9, 2015
    • Disco Corporation
    • Tsutomu Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FABRICATION METHOD FOR DEVICE HAVING DIE ATTACH FILM ON THE BACK SI...
    • Publication number 20090280622
    • Publication date Nov 12, 2009
    • Disco Corporation
    • Satoshi Genda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Laser beam machining system
    • Publication number 20080115891
    • Publication date May 22, 2008
    • Disco Corporation
    • Masanori Yoshida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing method for wafer
    • Publication number 20070007472
    • Publication date Jan 11, 2007
    • DISCO CORPORATION
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer holding mechanism
    • Publication number 20060203222
    • Publication date Sep 14, 2006
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser beam processing machine
    • Publication number 20060163224
    • Publication date Jul 27, 2006
    • DISCO CORPORATION
    • Noboru Takeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20060148211
    • Publication date Jul 6, 2006
    • DISCO CORPORATION
    • Kenichi Iwasaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20060105546
    • Publication date May 18, 2006
    • DISCO CORPORATION
    • Satoshi Genda
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Wafer dividing method
    • Publication number 20060045511
    • Publication date Mar 2, 2006
    • DISCO CORPORATION
    • Satoshi Genda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for the laser processing of a wafer
    • Publication number 20060009008
    • Publication date Jan 12, 2006
    • DISCO CORPORATION
    • Yasuomi Kaneuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20050106782
    • Publication date May 19, 2005
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor wafer dividing method
    • Publication number 20050101108
    • Publication date May 12, 2005
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of dividing a plate-like workpiece
    • Publication number 20050035100
    • Publication date Feb 17, 2005
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of dividing a plate-like workpiece
    • Publication number 20050035099
    • Publication date Feb 17, 2005
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR