Satoshi HIRANO

Person

Chita-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multi-layer wiring board
- Patent number 9,237,656
- Issue date Jan 12, 2016
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 9,006,580
- Issue date Apr 14, 2015
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 8,859,077
- Issue date Oct 14, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 8,847,082
- Issue date Sep 30, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of manufacturing the same
- Patent number 8,772,643
- Issue date Jul 8, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate
- Patent number 8,707,554
- Issue date Apr 29, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 8,658,905
- Issue date Feb 25, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and manufacturing method thereof
- Patent number 8,609,995
- Issue date Dec 17, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered wiring substrate
- Patent number 8,581,388
- Issue date Nov 12, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 8,530,751
- Issue date Sep 10, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate and method of manufacturing the same
- Patent number 8,450,622
- Issue date May 28, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered wiring board and method of manufacturing the same
- Patent number 8,389,871
- Issue date Mar 5, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,233,066
- Issue date Jun 19, 2007
- NEC Electronics Corporation
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,060,604
- Issue date Jun 13, 2006
- NGK Spark Plug Co., Ltd.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer-wiring substrate and method for fabricating same
- Patent number 6,674,017
- Issue date Jan 6, 2004
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed board
- Patent number 6,139,904
- Issue date Oct 31, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140215782
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...
- Publication number 20140202740
- Publication date Jul 24, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD
- Publication number 20130160290
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130161079
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20130111746
- Publication date May 9, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND MULTILAYER...
- Publication number 20120312590
- Publication date Dec 13, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20120024582
- Publication date Feb 2, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120018194
- Publication date Jan 26, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20110284269
- Publication date Nov 24, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20110232951
- Publication date Sep 29, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Substrate and Method of Manufacturing the Same
- Publication number 20110211320
- Publication date Sep 1, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered Wiring Board and Method of Manufacturing the Same
- Publication number 20110209910
- Publication date Sep 1, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...
- Publication number 20110200788
- Publication date Aug 18, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Substrate, and Method of Manufacturing the Same
- Publication number 20110198114
- Publication date Aug 18, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered Wiring Substrate
- Publication number 20110156272
- Publication date Jun 30, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Substrate
- Publication number 20110155438
- Publication date Jun 30, 2011
- NGK SPARK PLUG CO., LTD.
- Tatsuya ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...
- Publication number 20110155443
- Publication date Jun 30, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20060189125
- Publication date Aug 24, 2006
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20040053489
- Publication date Mar 18, 2004
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Satoshi HIRANO

Person

Patents Grantslast 30 patents

Method of manufacturing multi-layer wiring board

Method of manufacturing multilayer wiring substrate, and multilayer...

Method of manufacturing multilayer wiring substrate, and multilayer...

Multilayer wiring substrate

Multilayer wiring substrate, and method of manufacturing the same

Method of manufacturing multilayer wiring substrate

Multilayer wiring substrate

Multilayer wiring board and manufacturing method thereof

Multilayered wiring substrate

Multilayer wiring substrate

Multilayer wiring substrate and method of manufacturing the same

Multilayered wiring board and method of manufacturing the same

Multilayer wiring substrate, and method of producing same

Multilayer wiring substrate, and method of producing same

Multilayer-wiring substrate and method for fabricating same

Method of making a printed board

Patents Applicationslast 30 patents

MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...

METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD

MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND MULTILAYER...

MULTILAYER WIRING SUBSTRATE

MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYER WIRING SUBSTRATE

MULTILAYER WIRING SUBSTRATE

Multilayer Wiring Substrate and Method of Manufacturing the Same

Multilayered Wiring Board and Method of Manufacturing the Same

Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...

Multilayer Wiring Substrate, and Method of Manufacturing the Same

Multilayered Wiring Substrate

Multilayer Wiring Substrate

Method of Manufacturing Multilayer Wiring Substrate, and Multilayer...

Multilayer wiring substrate, and method of producing same

Multilayer wiring substrate, and method of producing same