TREA

Satoshi Kurokawa

Follow

Person

  • Ogaki-shi, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Package substrate and method for manufacturing package substrate
    • Patent number 9,763,319
    • Issue date Sep 12, 2017
    • Ibiden Co., Ltd.
    • Yasushi Inagaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package substrate and method for manufacturing package substrate
    • Patent number 9,443,800
    • Issue date Sep 13, 2016
    • Ibiden Co., Ltd.
    • Yasushi Inagaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Printed wiring board
    • Patent number 9,326,377
    • Issue date Apr 26, 2016
    • Ibiden Co., Ltd.
    • Haruhiko Morita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Package substrate
    • Patent number 9,287,250
    • Issue date Mar 15, 2016
    • Ibiden Co., Ltd.
    • Yasushi Inagaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package substrate
    • Patent number 9,263,784
    • Issue date Feb 16, 2016
    • Ibiden Co., Ltd.
    • Yasushi Inagaki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 8,743,557
    • Issue date Jun 3, 2014
    • Ibiden Co., Ltd.
    • Yasuhiko Mano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE SUBSTRATE
    • Publication number 20150357316
    • Publication date Dec 10, 2015
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
    • Publication number 20150327363
    • Publication date Nov 12, 2015
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE
    • Publication number 20150318596
    • Publication date Nov 5, 2015
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
    • Publication number 20150279772
    • Publication date Oct 1, 2015
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
    • Publication number 20140374150
    • Publication date Dec 25, 2014
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20140027165
    • Publication date Jan 30, 2014
    • IBIDEN CO., LTD.
    • Naohiko MORITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20130020116
    • Publication date Jan 24, 2013
    • IBIDEN CO., LTD.
    • Yasuhiko MANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20120152606
    • Publication date Jun 21, 2012
    • IBIDEN CO., LTD.
    • Satoshi Kurokawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...