Satoshi Takeuchi

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Soft magnetic member and manufacturing method of soft magnetic member
- Patent number 10,272,491
- Issue date Apr 30, 2019
- DENSO CORPORATION
- Eiichi Kobayashi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Induction heating apparatus
- Patent number 9,999,102
- Issue date Jun 12, 2018
- Denso Corporation
- Shuntaro Iguro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material heating and providing apparatus
- Patent number 9,351,346
- Issue date May 24, 2016
- Denso Corporation
- Tsuyoshi Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board manufacturing equipment
- Patent number 7,931,065
- Issue date Apr 26, 2011
- Denso Corporation
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded board device and faulty wiring detecting method...
- Patent number 7,889,510
- Issue date Feb 15, 2011
- Denso Corporation
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of manufacturing the same
- Patent number 7,879,656
- Issue date Feb 1, 2011
- Denso Corporation
- Hiroki Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of manufacturing the same
- Patent number 7,834,441
- Issue date Nov 16, 2010
- Denso Corporation
- Hiroki Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method for manufacturing the...
- Patent number 7,304,248
- Issue date Dec 4, 2007
- Denso Corporation
- Kazuo Tada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board manufacturing method
- Patent number 7,287,321
- Issue date Oct 30, 2007
- Denso Corporation
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with a built-in passive device, manufacturing...
- Patent number 7,286,367
- Issue date Oct 23, 2007
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board with embedded electri...
- Patent number 7,165,321
- Issue date Jan 23, 2007
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of rigid-flexible printed circuit board and st...
- Patent number 7,036,214
- Issue date May 2, 2006
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for monitoring biological abnormality and bloo...
- Patent number 6,923,769
- Issue date Aug 2, 2005
- Denso Corporation
- Katsuyoshi Nishii
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed wiring board with embedded electric device and method for m...
- Patent number 6,680,441
- Issue date Jan 20, 2004
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vital signal detecting apparatus
- Patent number 6,608,562
- Issue date Aug 19, 2003
- Denso Corporation
- Teiyuu Kimura
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
INDUCTION HEATING APPARATUS
- Publication number 20150282256
- Publication date Oct 1, 2015
- Denso Corporation
- Shuntaro Iguro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT MAGNETIC MEMBER AND MANUFACTURING METHOD OF SOFT MAGNETIC MEMBER
- Publication number 20150129794
- Publication date May 14, 2015
- DENSO CORPORATION
- Eiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL HEATING AND PROVIDING APPARATUS
- Publication number 20130213957
- Publication date Aug 22, 2013
- DENSO CORPORATION
- Tsuyoshi ARAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer substrate and method of manufacturing the same
- Publication number 20100175250
- Publication date Jul 15, 2010
- DENSO CORPORATION
- Hiroki Kamiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board manufacturing equipment
- Publication number 20090266492
- Publication date Oct 29, 2009
- DENSO CORPORATION
- Satoshi Takeuchi
- B30 - PRESSES
Information Patent Application
Multilayer substrate and method of manufacturing the same
- Publication number 20080136013
- Publication date Jun 12, 2008
- DENSO CORPORATION
- Hiroki Kamiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer board
- Publication number 20080017409
- Publication date Jan 24, 2008
- DENSO CORPORATION
- Satoshi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded board device and faulty wiring detecting method...
- Publication number 20070263369
- Publication date Nov 15, 2007
- DENSO CORPORATION
- Satoshi Takeuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-layer board manufacturing method
- Publication number 20060042078
- Publication date Mar 2, 2006
- DENSO Corporation
- Satoshi Takeuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-layer printed circuit board and method for manufacturing the...
- Publication number 20050139386
- Publication date Jun 30, 2005
- Kazuo Tada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board with embedded electri...
- Publication number 20040091687
- Publication date May 13, 2004
- Koji Kondo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing method of rigid-flexible printed circuit board and st...
- Publication number 20030173105
- Publication date Sep 18, 2003
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with a built-in passive device, manufacturing...
- Publication number 20030133275
- Publication date Jul 17, 2003
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board with embedded electric device and method for m...
- Publication number 20020192442
- Publication date Dec 19, 2002
- Koji Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for monitoring biological abnormality and bloo...
- Publication number 20020183627
- Publication date Dec 5, 2002
- Katsuyoshi Nishii
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Satoshi Takeuchi

Person

Patents Grantslast 30 patents

Soft magnetic member and manufacturing method of soft magnetic member

Induction heating apparatus

Material heating and providing apparatus

Printed circuit board manufacturing equipment

Component-embedded board device and faulty wiring detecting method...

Multilayer substrate and method of manufacturing the same

Multilayer substrate and method of manufacturing the same

Multi-layer printed circuit board and method for manufacturing the...

Multi-layer board manufacturing method

Printed circuit board with a built-in passive device, manufacturing...

Method for manufacturing printed wiring board with embedded electri...

Manufacturing method of rigid-flexible printed circuit board and st...

Method and apparatus for monitoring biological abnormality and bloo...

Printed wiring board with embedded electric device and method for m...

Vital signal detecting apparatus

Patents Applicationslast 30 patents

INDUCTION HEATING APPARATUS

SOFT MAGNETIC MEMBER AND MANUFACTURING METHOD OF SOFT MAGNETIC MEMBER

MATERIAL HEATING AND PROVIDING APPARATUS

Multilayer substrate and method of manufacturing the same

Printed circuit board manufacturing equipment

Multilayer substrate and method of manufacturing the same

Multilayer board

Component-embedded board device and faulty wiring detecting method...

Multi-layer board manufacturing method

Multi-layer printed circuit board and method for manufacturing the...

Method for manufacturing printed wiring board with embedded electri...

Manufacturing method of rigid-flexible printed circuit board and st...

Printed circuit board with a built-in passive device, manufacturing...

Printed wiring board with embedded electric device and method for m...

Method and apparatus for monitoring biological abnormality and bloo...