Sayeed Ahmed

Person

Canton, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tri-level inverter
- Patent number 7,505,294
- Issue date Mar 17, 2009
- Continental Automotive Systems US, Inc.
- Sayeed Ahmed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method of commonly controlling power converters
- Patent number 7,456,602
- Issue date Nov 25, 2008
- Continental Automotive Systems US, Inc.
- Richard J. Hampo
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power converter architecture employing at least one capacitor acros...
- Patent number 7,443,692
- Issue date Oct 28, 2008
- Continental Automotive Systems US, Inc.
- Ajay V. Patwardhan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Architecture for power modules such as power inverters
- Patent number 7,301,755
- Issue date Nov 27, 2007
- Siemens VDO Automotive Corporation
- Pablo Rodriguez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Architecture for power modules such as power inverters
- Patent number 7,292,451
- Issue date Nov 6, 2007
- Siemens VDO Automotive Corporation
- Pablo Rodriguez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Architecture for power modules such as power inverters
- Patent number 7,289,343
- Issue date Oct 30, 2007
- Siemens VDO Automotive Corporation
- Pablo Rodriguez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integration of planar transformer and/or planar inductor with power...
- Patent number 7,289,329
- Issue date Oct 30, 2007
- Siemens VDO Automotive Corporation
- Kanghua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,193,860
- Issue date Mar 20, 2007
- Ballard Power Systems Corporation
- Scott Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,187,558
- Issue date Mar 6, 2007
- Ballard Power Systems Corporation
- Scott T. Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power converter
- Patent number 7,180,763
- Issue date Feb 20, 2007
- Ballard Power Systems Corporation
- Ajay V. Patwardhan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Architecture for power modules such as power inverters
- Patent number 7,046,535
- Issue date May 16, 2006
- Ballard Power Systems Corporation
- Pablo Rodriguez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,012,810
- Issue date Mar 14, 2006
- Ballard Power Systems Corporation
- Scott Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Dual power module power system architecture
- Patent number 6,987,670
- Issue date Jan 17, 2006
- Ballard Power Systems Corporation
- Sayeed Ahmed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Assembly and method for direct cooling of motor end-winding
- Patent number 6,914,354
- Issue date Jul 5, 2005
- Ballard Power Systems Corporation
- David Seniawski
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module with voltage overshoot limiting
- Patent number 6,906,404
- Issue date Jun 14, 2005
- Ballard Power Systems Corporation
- Douglas K. Maly
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate-level DC bus design to reduce module inductance
- Patent number 6,845,017
- Issue date Jan 18, 2005
- Ballard Power Systems Corporation
- Sayeed Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press (non-soldered) contacts for high current electrical connectio...
- Patent number 6,793,502
- Issue date Sep 21, 2004
- Ballard Power Systems Corporation
- Scott Parkhill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet impingement cooling of electric motor end-windings
- Patent number 6,639,334
- Issue date Oct 28, 2003
- Ballard Power Systems Corporation
- Kanghua Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
EMI reduction in power modules through the use of integrated capaci...
- Patent number 6,636,429
- Issue date Oct 21, 2003
- Ballard Power Systems Corporation
- Douglas Maly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME-BASED MODULE DC BUS DESIGN TO REDUCE MODULE INDUCTANCE
- Publication number 20070193763
- Publication date Aug 23, 2007
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method of commonly controlling power converters
- Publication number 20070114954
- Publication date May 24, 2007
- Richard J. Hampo
- B60 - VEHICLES IN GENERAL
Information Patent Application
Tri-level inverter
- Publication number 20060274561
- Publication date Dec 7, 2006
- Ballard Power Systems Corporation
- Sayeed Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power system method and apparatus
- Publication number 20060152085
- Publication date Jul 13, 2006
- Fred Flett
- B60 - VEHICLES IN GENERAL
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20060082983
- Publication date Apr 20, 2006
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power converter
- Publication number 20060062023
- Publication date Mar 23, 2006
- Ajay V. Patwardhan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20060028806
- Publication date Feb 9, 2006
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Architecture for power modules such as power inverters
- Publication number 20060007721
- Publication date Jan 12, 2006
- Pablo Rodriguez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Integration of planar transformer and/or planar inductor with power...
- Publication number 20050270745
- Publication date Dec 8, 2005
- Kanghua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for power modules such as power inverters
- Publication number 20050162875
- Publication date Jul 28, 2005
- Pablo Rodriguez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Architecture for power modules such as power inverters
- Publication number 20050152100
- Publication date Jul 14, 2005
- Pablo Rodriguez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Architecture for power modules such as power inverters
- Publication number 20050152101
- Publication date Jul 14, 2005
- Pablo Rodriguez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module with heat exchange
- Publication number 20050128706
- Publication date Jun 16, 2005
- Ballard Power Systems Corporation
- Douglas K. Maly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual power module power system architecture
- Publication number 20040228094
- Publication date Nov 18, 2004
- Ballard Power Systems Corporation
- Sayeed Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power converter architecture employing at least one capacitor acros...
- Publication number 20040230847
- Publication date Nov 18, 2004
- Ballard Power Systems Corporation
- Ajay V. Patwardhan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power module with voltage overshoot limiting
- Publication number 20040227231
- Publication date Nov 18, 2004
- Ballard Power Systems Corporation
- Douglas K. Maly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly and method for direct cooling of motor end-winding
- Publication number 20030173840
- Publication date Sep 18, 2003
- Ballard Power Systems Corporation
- David Seniawski
- B60 - VEHICLES IN GENERAL
Information Patent Application
Jet impingement cooling of electric motor end-windings
- Publication number 20030102728
- Publication date Jun 5, 2003
- Kanghua Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20020167828
- Publication date Nov 14, 2002
- Ballard Power Systems Corporation
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI reduction in power modules through the use of integrated capaci...
- Publication number 20020126465
- Publication date Sep 12, 2002
- Douglas Maly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-level DC bus design to reduce module inductance
- Publication number 20020118560
- Publication date Aug 29, 2002
- Sayeed Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Press (non-soldered) contacts for high current electrical connectio...
- Publication number 20020111050
- Publication date Aug 15, 2002
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20020034088
- Publication date Mar 21, 2002
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS

Sayeed Ahmed

Person

Patents Grantslast 30 patents

Tri-level inverter

System and method of commonly controlling power converters

Power converter architecture employing at least one capacitor acros...

Architecture for power modules such as power inverters

Architecture for power modules such as power inverters

Architecture for power modules such as power inverters

Integration of planar transformer and/or planar inductor with power...

Leadframe-based module DC bus design to reduce module inductance

Leadframe-based module DC bus design to reduce module inductance

Power converter

Architecture for power modules such as power inverters

Leadframe-based module DC bus design to reduce module inductance

Dual power module power system architecture

Assembly and method for direct cooling of motor end-winding

Power module with voltage overshoot limiting

Substrate-level DC bus design to reduce module inductance

Press (non-soldered) contacts for high current electrical connectio...

Jet impingement cooling of electric motor end-windings

EMI reduction in power modules through the use of integrated capaci...

Patents Applicationslast 30 patents

LEADFRAME-BASED MODULE DC BUS DESIGN TO REDUCE MODULE INDUCTANCE

System and method of commonly controlling power converters

Tri-level inverter

Power system method and apparatus

Leadframe-based module DC bus design to reduce module inductance

Power converter

Leadframe-based module DC bus design to reduce module inductance

Architecture for power modules such as power inverters

Integration of planar transformer and/or planar inductor with power...

Architecture for power modules such as power inverters

Architecture for power modules such as power inverters

Architecture for power modules such as power inverters

Power module with heat exchange

Dual power module power system architecture

Power converter architecture employing at least one capacitor acros...

Power module with voltage overshoot limiting

Assembly and method for direct cooling of motor end-winding

Jet impingement cooling of electric motor end-windings

Leadframe-based module DC bus design to reduce module inductance

EMI reduction in power modules through the use of integrated capaci...

Substrate-level DC bus design to reduce module inductance

Press (non-soldered) contacts for high current electrical connectio...

Leadframe-based module DC bus design to reduce module inductance