Sayoon Kang

Follow

Person

Seoul-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,646,241
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jaehoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple semiconductor chips
- Patent number 11,205,631
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices and methods of manufacturing the same
- Patent number 9,355,931
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for a semiconductor device and method of manufacture
- Patent number 8,105,934
- Issue date Jan 31, 2012
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230268241
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Jaehoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200335469
- Publication date Oct 22, 2020
- Samsung Electronics Co., Ltd.
- Yonghoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200273771
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Jaehoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150206869
- Publication date Jul 23, 2015
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure for a semiconductor device and method of manufacture
- Publication number 20090305494
- Publication date Dec 10, 2009
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure for a semiconductor device and method of manufacture
- Publication number 20050233569
- Publication date Oct 20, 2005
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS