Scott Gilbert

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic chip with under-side power block
- Patent number 11,538,753
- Issue date Dec 27, 2022
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,980,134
- Issue date Apr 13, 2021
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land side and die side cavities to reduce package z-height
- Patent number 10,950,537
- Issue date Mar 16, 2021
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land side and die side cavities to reduce package z-height
- Patent number 10,297,542
- Issue date May 21, 2019
- Intel Corporation
- MD Altaf Hossain
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,278,292
- Issue date Apr 30, 2019
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land side and die side cavities to reduce package z-height
- Patent number 9,799,556
- Issue date Oct 24, 2017
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land side and die side cavities to reduce package z-height
- Patent number 9,721,882
- Issue date Aug 1, 2017
- Intel Corporation
- MD Altaf Hossain
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Land side and die side cavities to reduce package Z-height
- Patent number 9,293,426
- Issue date Mar 22, 2016
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BGA structure using CTF balls in high stress regions
- Patent number 9,237,659
- Issue date Jan 12, 2016
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable thermal interface material
- Patent number 7,253,523
- Issue date Aug 7, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electrical connections between a circuit board and an integr...
- Patent number 7,241,147
- Issue date Jul 10, 2007
- Intel Corporation
- Shawn L. Lloyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial component
- Patent number 7,098,534
- Issue date Aug 29, 2006
- Intel Corporation
- Shawn L. Lloyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20210185830
- Publication date Jun 17, 2021
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20200051901
- Publication date Feb 13, 2020
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CHIP WITH UNDER-SIDE POWER BLOCK
- Publication number 20190333854
- Publication date Oct 31, 2019
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20190230795
- Publication date Jul 25, 2019
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20180108605
- Publication date Apr 19, 2018
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20170141024
- Publication date May 18, 2017
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20160181145
- Publication date Jun 23, 2016
- Intel Corporation
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS
- Publication number 20160128207
- Publication date May 5, 2016
- Intel Corporation
- MD Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS
- Publication number 20140092572
- Publication date Apr 3, 2014
- MD Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20140091428
- Publication date Apr 3, 2014
- MD Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT
- Publication number 20120161312
- Publication date Jun 28, 2012
- Md Altaf HOSSAIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SACRIFICIAL COMPONENT
- Publication number 20060288567
- Publication date Dec 28, 2006
- Intel Corporation
- Shawn L. Lloyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Making electrical connections between a circuit board and an integr...
- Publication number 20050227509
- Publication date Oct 13, 2005
- Shawn L. Lloyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial component
- Publication number 20050218516
- Publication date Oct 6, 2005
- Shawn L. Lloyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reworkable thermal interface material
- Publication number 20050027055
- Publication date Feb 3, 2005
- Intel Corporation
- Ashay A. Dani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Scott Gilbert

Person

Patents Grantslast 30 patents

Electronic chip with under-side power block

Method for orienting solder balls on a BGA device

Method for orienting solder balls on a BGA device

Land side and die side cavities to reduce package z-height

Land side and die side cavities to reduce package z-height

Method for orienting solder balls on a BGA device

Land side and die side cavities to reduce package z-height

Land side and die side cavities to reduce package z-height

Land side and die side cavities to reduce package Z-height

BGA structure using CTF balls in high stress regions

Reworkable thermal interface material

Making electrical connections between a circuit board and an integr...

Sacrificial component

Patents Applicationslast 30 patents

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

ELECTRONIC CHIP WITH UNDER-SIDE POWER BLOCK

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS

BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT

SACRIFICIAL COMPONENT

Making electrical connections between a circuit board and an integr...

Sacrificial component

Reworkable thermal interface material