Scott Jay Crane

Person

Aromas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 9,824,999
- Issue date Nov 21, 2017
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 9,252,116
- Issue date Feb 2, 2016
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,723,332
- Issue date May 13, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 8,704,379
- Issue date Apr 22, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,629,543
- Issue date Jan 14, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 8,324,081
- Issue date Dec 4, 2012
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 7,923,349
- Issue date Apr 12, 2011
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode-laser curing of liquid epoxide encapsulants
- Patent number 6,913,794
- Issue date Jul 5, 2005
- Coherent, Inc.
- Anthony P. Hoult
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20160104689
- Publication date Apr 14, 2016
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20140213020
- Publication date Jul 31, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20110147943
- Publication date Jun 23, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Interconnected Stacked Die Assemblies
- Publication number 20110037159
- Publication date Feb 17, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20090065916
- Publication date Mar 12, 2009
- VERTICAL CIRCUITS, INC.
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20080315434
- Publication date Dec 25, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
- Publication number 20080303131
- Publication date Dec 11, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode-laser curing of liquid epoxide encapsulants
- Publication number 20030131932
- Publication date Jul 17, 2003
- Anthony P. Hoult
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Scott Jay Crane

Person

Patents Grantslast 30 patents

Semiconductor die mount by conformal die coating

Semiconductor die mount by conformal die coating

Electrically interconnected stacked die assemblies

Semiconductor die mount by conformal die coating

Electrically interconnected stacked die assemblies

Wafer level surface passivation of stackable integrated circuit chips

Wafer level surface passivation of stackable integrated circuit chips

Diode-laser curing of liquid epoxide encapsulants

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS

Electrically Interconnected Stacked Die Assemblies

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS

ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES

Diode-laser curing of liquid epoxide encapsulants