Scott Parkhill

Person

Perrysburg, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,193,860
- Issue date Mar 20, 2007
- Ballard Power Systems Corporation
- Scott Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,187,558
- Issue date Mar 6, 2007
- Ballard Power Systems Corporation
- Scott T. Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Leadframe-based module DC bus design to reduce module inductance
- Patent number 7,012,810
- Issue date Mar 14, 2006
- Ballard Power Systems Corporation
- Scott Parkhill
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate-level DC bus design to reduce module inductance
- Patent number 6,845,017
- Issue date Jan 18, 2005
- Ballard Power Systems Corporation
- Sayeed Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press (non-soldered) contacts for high current electrical connectio...
- Patent number 6,793,502
- Issue date Sep 21, 2004
- Ballard Power Systems Corporation
- Scott Parkhill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI reduction in power modules through the use of integrated capaci...
- Patent number 6,636,429
- Issue date Oct 21, 2003
- Ballard Power Systems Corporation
- Douglas Maly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME-BASED MODULE DC BUS DESIGN TO REDUCE MODULE INDUCTANCE
- Publication number 20070193763
- Publication date Aug 23, 2007
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20060082983
- Publication date Apr 20, 2006
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20060028806
- Publication date Feb 9, 2006
- Scott Parkhill
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20020167828
- Publication date Nov 14, 2002
- Ballard Power Systems Corporation
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI reduction in power modules through the use of integrated capaci...
- Publication number 20020126465
- Publication date Sep 12, 2002
- Douglas Maly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-level DC bus design to reduce module inductance
- Publication number 20020118560
- Publication date Aug 29, 2002
- Sayeed Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Press (non-soldered) contacts for high current electrical connectio...
- Publication number 20020111050
- Publication date Aug 15, 2002
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based module DC bus design to reduce module inductance
- Publication number 20020034088
- Publication date Mar 21, 2002
- Scott Parkhill
- H01 - BASIC ELECTRIC ELEMENTS

Scott Parkhill

Person

Patents Grantslast 30 patents

Leadframe-based module DC bus design to reduce module inductance

Leadframe-based module DC bus design to reduce module inductance

Leadframe-based module DC bus design to reduce module inductance

Substrate-level DC bus design to reduce module inductance

Press (non-soldered) contacts for high current electrical connectio...

EMI reduction in power modules through the use of integrated capaci...

Patents Applicationslast 30 patents

LEADFRAME-BASED MODULE DC BUS DESIGN TO REDUCE MODULE INDUCTANCE

Leadframe-based module DC bus design to reduce module inductance

Leadframe-based module DC bus design to reduce module inductance

Leadframe-based module DC bus design to reduce module inductance

EMI reduction in power modules through the use of integrated capaci...

Substrate-level DC bus design to reduce module inductance

Press (non-soldered) contacts for high current electrical connectio...

Leadframe-based module DC bus design to reduce module inductance