Se-Young Yang

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having buried gate ele...
- Patent number 11,670,537
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having buried gate ele...
- Patent number 10,930,544
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotation joint and semiconductor device having the same
- Patent number 7,884,487
- Issue date Feb 8, 2011
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packages including sinuous lead frames
- Patent number 7,777,308
- Issue date Aug 17, 2010
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale package and method for manufacturing the same
- Patent number 7,692,314
- Issue date Apr 6, 2010
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low power CSD linear phase FIR filter architecture using vertical c...
- Patent number 7,016,926
- Issue date Mar 21, 2006
- Samsung Electronics Co., Ltd.
- Young-Beom Jang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230148126
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Hye Ran LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230085469
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Se Min YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BURIED GATE ELE...
- Publication number 20210183689
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BURIED GATE ELE...
- Publication number 20200243375
- Publication date Jul 30, 2020
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER
- Publication number 20100081236
- Publication date Apr 1, 2010
- Samsung Electronics Co., Ltd.
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and electronic products employing the same
- Publication number 20090146300
- Publication date Jun 11, 2009
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDNG SINUOUS LEAD FRAMES
- Publication number 20090146274
- Publication date Jun 11, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Se-Young Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURI...
- Publication number 20080290513
- Publication date Nov 27, 2008
- Samsung Electronics Co., Ltd.
- Hyung-Jik BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATION JOINT AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20080122108
- Publication date May 29, 2008
- Samsung Electronics Co., Ltd.
- Se-Young YANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS,...
- Publication number 20080093725
- Publication date Apr 24, 2008
- Samsung Electronics Co., Ltd.
- So-Young JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING TH...
- Publication number 20080087995
- Publication date Apr 17, 2008
- Samsung Electronics Co., Ltd.
- Se-Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080061436
- Publication date Mar 13, 2008
- Samsung Electronics Co., Ltd.
- Se-Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of dicing wafer and die
- Publication number 20070155055
- Publication date Jul 5, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Se-young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Board-on-chip package and stack package using the same
- Publication number 20070029674
- Publication date Feb 8, 2007
- Dong-Kil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low power CSD linear phase FIR filter architecture using vertical c...
- Publication number 20030105787
- Publication date Jun 5, 2003
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Beom Jang
- H03 - BASIC ELECTRONIC CIRCUITRY

Se-Young Yang

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having buried gate ele...

Method of manufacturing semiconductor device having buried gate ele...

Rotation joint and semiconductor device having the same

Integrated circuit packages including sinuous lead frames

Wafer level chip scale package and method for manufacturing the same

Low power CSD linear phase FIR filter architecture using vertical c...

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BURIED GATE ELE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BURIED GATE ELE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

Semiconductor packages and electronic products employing the same

INTEGRATED CIRCUIT PACKAGES INCLUDNG SINUOUS LEAD FRAMES

SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURI...

ROTATION JOINT AND SEMICONDUCTOR DEVICE HAVING THE SAME

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS,...

FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING TH...

WAFER LEVEL CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method of dicing wafer and die

Board-on-chip package and stack package using the same

Low power CSD linear phase FIR filter architecture using vertical c...