Sean M. Malolepszy

Person

Sherman, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,225,982
- Issue date Jul 24, 2012
- Texas Instruments Incorporated
- Rex W Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual capillary IC wirebonding
- Patent number 8,008,183
- Issue date Aug 30, 2011
- Texas Instruments Incorporated
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for precision placement of integrated circuit overcoat mate...
- Patent number 7,884,449
- Issue date Feb 8, 2011
- Texas Instruments Incorporated
- Sean M. Malolepszy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Output impedance compensation for linear voltage regulators
- Patent number 7,675,272
- Issue date Mar 9, 2010
- Texas Instruments Incoporated
- Ronald Andrew Michallick
- G05 - CONTROLLING REGULATING
Information Patent Grant
Process for precision placement of integrated circuit overcoat mate...
- Patent number 7,648,857
- Issue date Jan 19, 2010
- Texas Instruments Incorporated
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing engine, method of routing a test probe and testing system e...
- Patent number 7,598,759
- Issue date Oct 6, 2009
- Texas Instruments Incorporated
- Rex W. Pirkle
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having voltage output function trim circuitry...
- Patent number 7,241,646
- Issue date Jul 10, 2007
- Texas Instruments Incorporated
- Sean Malolepszy
- G11 - INFORMATION STORAGE
Information Patent Grant
Wirebonder to bond an IC chip to a substrate
- Patent number 7,152,308
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond surface conditioning system for improved bondability
- Patent number 6,602,726
- Issue date Aug 5, 2003
- Texas Instruments Incorporated
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20110272449
- Publication date Nov 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Rex Warren PIRKLE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Precision Placement of Integrated Circuit Overcoat Mate...
- Publication number 20100072610
- Publication date Mar 25, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Ordering the Selection of Integrated Circuit...
- Publication number 20090288057
- Publication date Nov 19, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Rex W. Pirkle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual Capillary IC Wirebonding
- Publication number 20090091006
- Publication date Apr 9, 2009
- Rex Warren Pirkle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Output impedance compensation for linear voltage regulators
- Publication number 20090039847
- Publication date Feb 12, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Ronald Andrew Michallick
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING...
- Publication number 20090001597
- Publication date Jan 1, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Rex W. Pirkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING ENGINE, METHOD OF ROUTING A TEST PROBE AND TESTING SYSTEM E...
- Publication number 20080106286
- Publication date May 8, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Rex W. Pirkle
- G01 - MEASURING TESTING
Information Patent Application
PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATE...
- Publication number 20080036046
- Publication date Feb 14, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Surface Conditioning System for Improved Bondability
- Publication number 20070094867
- Publication date May 3, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having voltage output function trim circuitry...
- Publication number 20060199283
- Publication date Sep 7, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Sean M. Malolepszy
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated circuit with removable scribe street trim and test pads
- Publication number 20050239268
- Publication date Oct 27, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Rex W. Pirkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond surface conditioning system for improved bondability
- Publication number 20040093725
- Publication date May 20, 2004
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND SURFACE CONDITIONING SYSTEM FOR IMPROVED BONDABILITY
- Publication number 20030143778
- Publication date Jul 31, 2003
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS

Sean M. Malolepszy

Person

Patents Grantslast 30 patents

Dual capillary IC wirebonding

Dual capillary IC wirebonding

Process for precision placement of integrated circuit overcoat mate...

Output impedance compensation for linear voltage regulators

Process for precision placement of integrated circuit overcoat mate...

Routing engine, method of routing a test probe and testing system e...

Semiconductor device having voltage output function trim circuitry...

Wirebonder to bond an IC chip to a substrate

Bond surface conditioning system for improved bondability

Patents Applicationslast 30 patents

Dual Capillary IC Wirebonding

Process for Precision Placement of Integrated Circuit Overcoat Mate...

System and Method for Ordering the Selection of Integrated Circuit...

Dual Capillary IC Wirebonding

Output impedance compensation for linear voltage regulators

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING...

ROUTING ENGINE, METHOD OF ROUTING A TEST PROBE AND TESTING SYSTEM E...

PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATE...

Bond Surface Conditioning System for Improved Bondability

Semiconductor device having voltage output function trim circuitry...

Integrated circuit with removable scribe street trim and test pads

Bond surface conditioning system for improved bondability

BOND SURFACE CONDITIONING SYSTEM FOR IMPROVED BONDABILITY