Sebastian Brunner

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Package including a substrate with high resolution rectangular cros...
- Patent number 11,450,598
- Issue date Sep 20, 2022
- QUALCOMM Incorporated
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component substrate having a protective function
- Patent number 11,239,010
- Issue date Feb 1, 2022
- EPCOS AG
- Christian Faistauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate that includes a stress buffer layer
- Patent number 11,088,090
- Issue date Aug 10, 2021
- QUALCOMM Incorporated
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-LED system
- Patent number 10,818,641
- Issue date Oct 27, 2020
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having an ESD protective function and method for...
- Patent number 10,490,322
- Issue date Nov 26, 2019
- Epcos AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component assembly
- Patent number 10,278,285
- Issue date Apr 30, 2019
- EPCOS AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier plate, device having the carrier plate and method for produ...
- Patent number 10,117,329
- Issue date Oct 30, 2018
- QUALCOMM Incorporated
- Sebastian Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric contact connection of a multilayer...
- Patent number 10,090,454
- Issue date Oct 2, 2018
- Epcos AG
- Dieter Somitsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with protection function and method for producing same
- Patent number 9,865,381
- Issue date Jan 9, 2018
- EPCOS AG
- Yasuharu Miyauchi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Light-emitting diode device
- Patent number 9,449,958
- Issue date Sep 20, 2016
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode device
- Patent number 9,418,980
- Issue date Aug 16, 2016
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode device
- Patent number 9,337,408
- Issue date May 10, 2016
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode arrangement, module, and method for producing...
- Patent number 9,287,247
- Issue date Mar 15, 2016
- EPCOS AG
- Christian Faistauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electrical component, and electrical component
- Patent number 9,230,719
- Issue date Jan 5, 2016
- EPCOS AG
- Thomas Feichtinger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carrier device, arrangement comprising such a carrier device, and m...
- Patent number 9,001,523
- Issue date Apr 7, 2015
- EPCOS AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component and component and method for the production thereof
- Patent number 8,415,251
- Issue date Apr 9, 2013
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module substrate and production method
- Patent number 8,413,321
- Issue date Apr 9, 2013
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of an electrical component and component
- Patent number 7,928,558
- Issue date Apr 19, 2011
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component and circuit configuration with the electrical...
- Patent number 7,710,710
- Issue date May 4, 2010
- EPCOS AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric multilayer component
- Patent number 7,710,233
- Issue date May 4, 2010
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER
- Publication number 20240097648
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A CAP SUBSTRATE COMPRISIN...
- Publication number 20230101228
- Publication date Mar 30, 2023
- RF360 EUROPE GMBH
- Sebastian BRUNNER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROS...
- Publication number 20220037246
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER LAYER
- Publication number 20210249361
- Publication date Aug 12, 2021
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-LED System
- Publication number 20190103384
- Publication date Apr 4, 2019
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER HAVING AN ESD PROTECTIVE FUNCTION AND METHOD FOR...
- Publication number 20190019604
- Publication date Jan 17, 2019
- EPCOS AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT SUBSTRATE HAVING A PROTECTIVE FUNCTION AND METHOD FOR PRO...
- Publication number 20190013120
- Publication date Jan 10, 2019
- EPCOS AG
- Christian Faistauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate
- Publication number 20170311455
- Publication date Oct 26, 2017
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip with Protection Function and Method for Producing Same
- Publication number 20170011827
- Publication date Jan 12, 2017
- EPCOS AG
- Yasuharu Miyauchi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Light-Emitting Diode Arrangement, Module, and Method for Producing...
- Publication number 20150287703
- Publication date Oct 8, 2015
- EPCOS AG
- Christian Faistauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-emitting Diode Device
- Publication number 20150243865
- Publication date Aug 27, 2015
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Component Assembly
- Publication number 20150245481
- Publication date Aug 27, 2015
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Plate, Device Having the Carrier Plate and Method for Produ...
- Publication number 20150223329
- Publication date Aug 6, 2015
- EPCOS AG
- Sebastian Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light-Emitting Diode Device
- Publication number 20150144983
- Publication date May 28, 2015
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electric Contact Connection of a Multilayer...
- Publication number 20150022055
- Publication date Jan 22, 2015
- EPCOS AG
- Dieter Somitsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL COMPONENT, AND ELECTRICAL COMPONENT
- Publication number 20140225710
- Publication date Aug 14, 2014
- EPCOS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Device, Arrangement Comprising such a Carrier Device, and M...
- Publication number 20120218728
- Publication date Aug 30, 2012
- EPCOS AG
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENT AND COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20110146069
- Publication date Jun 23, 2011
- EPCOS AG, a corporation of Germany
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Component
- Publication number 20110148546
- Publication date Jun 23, 2011
- Thomas Feichtinger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Module Substrate and Production Method
- Publication number 20100224394
- Publication date Sep 9, 2010
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with Flat Construction and Method for Placing Components
- Publication number 20090174054
- Publication date Jul 9, 2009
- Christian Block
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Multilayer Component with Solder Contact
- Publication number 20070271782
- Publication date Nov 29, 2007
- Christian Block
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of an Electrical Component and Component
- Publication number 20070235834
- Publication date Oct 11, 2007
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric multilayer component
- Publication number 20060249758
- Publication date Nov 9, 2006
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical component and switching mechanism
- Publication number 20060170010
- Publication date Aug 3, 2006
- Sebastian Brunner
- H03 - BASIC ELECTRONIC CIRCUITRY

Sebastian Brunner

Person

Patents Grantslast 30 patents

Package including a substrate with high resolution rectangular cros...

Component substrate having a protective function

Package comprising a substrate that includes a stress buffer layer

Multi-LED system

Component carrier having an ESD protective function and method for...

Electric component assembly

Carrier plate, device having the carrier plate and method for produ...

Method for producing an electric contact connection of a multilayer...

Chip with protection function and method for producing same

Light-emitting diode device

Light-emitting diode device

Light-emitting diode device

Light-emitting diode arrangement, module, and method for producing...

Method for producing an electrical component, and electrical component

Carrier device, arrangement comprising such a carrier device, and m...

Electric component and component and method for the production thereof

Module substrate and production method

Production of an electrical component and component

Electrical component and circuit configuration with the electrical...

Electric multilayer component

Patents Applicationslast 30 patents

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A CAP SUBSTRATE COMPRISIN...

PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROS...

PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER LAYER

Multi-LED System

COMPONENT CARRIER HAVING AN ESD PROTECTIVE FUNCTION AND METHOD FOR...

COMPONENT SUBSTRATE HAVING A PROTECTIVE FUNCTION AND METHOD FOR PRO...

Method for Producing a Multi-Layer Substrate and Multi-Layer Substrate

Chip with Protection Function and Method for Producing Same

Light-Emitting Diode Arrangement, Module, and Method for Producing...

Light-emitting Diode Device

Electric Component Assembly

Carrier Plate, Device Having the Carrier Plate and Method for Produ...

Light-Emitting Diode Device

Method for Producing an Electric Contact Connection of a Multilayer...

METHOD FOR PRODUCING AN ELECTRICAL COMPONENT, AND ELECTRICAL COMPONENT

Carrier Device, Arrangement Comprising such a Carrier Device, and M...

ELECTRIC COMPONENT AND COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

Multilayer Component

Module Substrate and Production Method

Module with Flat Construction and Method for Placing Components

Electrical Multilayer Component with Solder Contact

Method for the Production of an Electrical Component and Component

Electric multilayer component

Electrical component and switching mechanism