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last 30 patents
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Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
11,227,809
Issue date
Jan 18, 2022
JCET Semiconductor (Shaoxing) Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of using substrate having base and...
Patent number
10,242,948
Issue date
Mar 26, 2019
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
9,627,338
Issue date
Apr 18, 2017
STATS ChipPAC Pte. Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of using substrate having base and...
Patent number
9,559,039
Issue date
Jan 31, 2017
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
Patent number
9,240,331
Issue date
Jan 19, 2016
STATS ChipPAC, Ltd.
KyungMoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20220093479
Publication date
Mar 24, 2022
JCET Semiconductor (Shaoxing) Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20170186660
Publication date
Jun 29, 2017
STATS ChipPAC Pte Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Using Substrate Having Base and...
Publication number
20170098610
Publication date
Apr 6, 2017
STATS ChipPAC Pte Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
Publication number
20140252641
Publication date
Sep 11, 2014
STATS ChipPAC, Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
Publication number
20140175661
Publication date
Jun 26, 2014
STATS ChipPAC, Ltd.
KyungMoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Using Substrate Having Base and...
Publication number
20140077389
Publication date
Mar 20, 2014
STATS ChipPAC, Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Under bump metallurgy in integrated circuits
Publication number
20060160267
Publication date
Jul 20, 2006
STATS ChipPAC Ltd.
Hyeong Ryeol Hur
H01 - BASIC ELECTRIC ELEMENTS