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last 30 patents
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Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
9,324,676
Issue date
Apr 26, 2016
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
Patent number
9,147,623
Issue date
Sep 29, 2015
Micron Technology, Inc.
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,900,923
Issue date
Dec 2, 2014
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
Patent number
8,803,307
Issue date
Aug 12, 2014
Micron Technology, Inc.
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
Patent number
8,501,546
Issue date
Aug 6, 2013
Micron Technology, Inc.
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
8,399,971
Issue date
Mar 19, 2013
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
Patent number
8,093,702
Issue date
Jan 10, 2012
Micron Technology, Inc.
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
Patent number
7,741,150
Issue date
Jun 22, 2010
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
Publication number
20240194547
Publication date
Jun 13, 2024
Micron Technology, Inc.
Ling PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
Publication number
20240194630
Publication date
Jun 13, 2024
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
Publication number
20240162207
Publication date
May 16, 2024
Micron Technology, Inc.
Kelvin Aik Boo TAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Publication number
20240162206
Publication date
May 16, 2024
Micron Technology, Inc.
Seng Kim YE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
Publication number
20240071980
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING
Publication number
20240071869
Publication date
Feb 29, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240071990
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Publication number
20240074048
Publication date
Feb 29, 2024
Micron Technology, Inc.
Ling Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE
Publication number
20240063201
Publication date
Feb 22, 2024
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES
Publication number
20240063135
Publication date
Feb 22, 2024
Micron Technology, Inc.
Hong Wan NG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING FOR STACKED MEMORY DIES
Publication number
20240063168
Publication date
Feb 22, 2024
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASS...
Publication number
20230268327
Publication date
Aug 24, 2023
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20150130035
Publication date
May 14, 2015
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
Publication number
20140346683
Publication date
Nov 27, 2014
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
Publication number
20130292854
Publication date
Nov 7, 2013
Edmund Koon Tian Lua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20130217182
Publication date
Aug 22, 2013
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20100237510
Publication date
Sep 23, 2010
Micron Technology, Inc.
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H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
Publication number
20080128900
Publication date
Jun 5, 2008
Micron Technology, Inc.
See Hiong Leow
H01 - BASIC ELECTRIC ELEMENTS