Seiichi Miyazaki

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Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer manufacturing method and wafer
- Patent number 7,250,368
- Issue date Jul 31, 2007
- Shin-Etsu Handotai Co., Ltd.
- Takahiro Kida
- B24 - GRINDING POLISHING
Information Patent Grant
Etching method for semiconductor silicon wafer
- Patent number 6,844,269
- Issue date Jan 18, 2005
- Shin-Etsu Handotai Co., Ltd.
- Seiichi Miyazaki
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,432,837
- Issue date Aug 13, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,346,485
- Issue date Feb 12, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers processing method and semiconductor wafers pro...
- Patent number 6,239,039
- Issue date May 29, 2001
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning semiconductor wafers after lapping
- Patent number 5,976,983
- Issue date Nov 2, 1999
- Shin-Etsu Handotai Co., Ltd.
- Seiichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Production method for silicon wafer and silicon wafer and soi wafer
- Publication number 20040072437
- Publication date Apr 15, 2004
- Naoto Iizuka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor wafer processing method and semiconductor wafers prod...
- Publication number 20010008807
- Publication date Jul 19, 2001
- SHIN-ETSU HANDOTAI CO., LTD.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS