Seiji Amakusa

Follow

Person

Kariya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,965,211
- Issue date Oct 12, 1999
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,039,338
- Issue date Aug 13, 1991
- Nippondenso Co. Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...