Membership
Tour
Register
Log in
Seiji Ichikawa
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of producing a semiconductor device
Patent number
6,467,666
Issue date
Oct 22, 2002
NEC Corporation
Seiji Ichikawa
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Semiconductor device having lead terminals bent in J-shape
Patent number
6,319,753
Issue date
Nov 20, 2001
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having pellet mounted on radiating plate thereof
Patent number
6,242,797
Issue date
Jun 5, 2001
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device with a pair of radia...
Patent number
6,177,720
Issue date
Jan 23, 2001
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic-encapsulated semiconductor device and fabrication method th...
Patent number
6,175,150
Issue date
Jan 16, 2001
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device with a pair of radia...
Patent number
6,165,818
Issue date
Dec 26, 2000
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with radiation plate for high radiation charac...
Patent number
6,150,715
Issue date
Nov 21, 2000
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having lead terminals bent in J-shape
Patent number
6,104,086
Issue date
Aug 15, 2000
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component
Patent number
6,011,303
Issue date
Jan 4, 2000
NEC Corporation
Junichi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrahigh-frequency electronic component and method of manufacturin...
Patent number
5,970,322
Issue date
Oct 19, 1999
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame flash removing method and apparatus
Patent number
5,956,574
Issue date
Sep 21, 1999
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hollow package manufacturing method
Patent number
5,904,501
Issue date
May 18, 1999
NEC Corporation
Masatoshi Ohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold package for sealing a chip
Patent number
5,905,301
Issue date
May 18, 1999
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrahigh-frequency electronic component
Patent number
5,889,232
Issue date
Mar 30, 1999
NEC Corporation
Seiji Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of producing a semiconductor device
Publication number
20010048014
Publication date
Dec 6, 2001
NEC Corporation
Seiji Ichikawa
B28 - WORKING CEMENT, CLAY, OR STONE