Claims
- 1. A method of manufacturing an ultrahigh-frequency electronic component having an ultrahigh-frequency chip mounted on a lead frame and electrically connected thereto by wire bonding, the ultrahigh-frequency chip being encased by sealing resin, comprising:
- placing the ultrahigh-frequency chip and the lead frame in a first mold cavity of a primary mold die set;
- introducing a first sealing resin into said first mold cavity under a first condition to produce voids in the first sealing resin;
- removing the ultrahigh-frequency chip and the lead frame encased in the solidified first sealing resin from said primary mold die set;
- placing the ultrahigh-frequency chip and the lead frame encased in the solidified first sealing resin in a second mold cavity of a secondary mold die set;
- introducing a second sealing resin into said second mold cavity under a second condition to produce no voids in the second sealing resin in order to encase the first sealing resin encasing said ultrahigh-frequency chip and the lead frame; and
- removing the resin encased chip and lead frame from the second die set as the ultrahigh-frequency electronic component.
- 2. A method according to claim 1, wherein said first condition comprises a pressure lower than a normal pressure under which a sealing resin is introduced.
- 3. A method according to claim 1, wherein said first sealing resin and said second sealing resin are the same types of resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8-118831 |
May 1996 |
JPX |
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Parent Case Info
This is a divisional of Application Ser. No. 08/855,537 filed May 13, 1997 U.S. Pat. No. 5,889,232.
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4890155 |
Miyagawa et al. |
Dec 1989 |
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5304512 |
Arai et al. |
Apr 1994 |
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Number |
Date |
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61-166138 |
Jul 1986 |
JPX |
61-237455 |
Oct 1986 |
JPX |
63-79353 |
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JPX |
5251591 |
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JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
855537 |
May 1997 |
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