Seiji Shirai

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 9,060,446
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 8,987,603
- Issue date Mar 24, 2015
- Ibiden Co,. Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,842,440
- Issue date Sep 23, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,830,691
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,780,573
- Issue date Jul 15, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,763,241
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,717,772
- Issue date May 6, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,331,102
- Issue date Dec 11, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 8,115,111
- Issue date Feb 14, 2012
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,116,091
- Issue date Feb 14, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,107,253
- Issue date Jan 31, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,995,352
- Issue date Aug 9, 2011
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,978,478
- Issue date Jul 12, 2011
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,881,069
- Issue date Feb 1, 2011
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,864,543
- Issue date Jan 4, 2011
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,864,542
- Issue date Jan 4, 2011
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,855,894
- Issue date Dec 21, 2010
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 7,737,366
- Issue date Jun 15, 2010
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 7,622,183
- Issue date Nov 24, 2009
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 7,390,974
- Issue date Jun 24, 2008
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 7,342,803
- Issue date Mar 11, 2008
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing printed circuit...
- Patent number 7,307,852
- Issue date Dec 11, 2007
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board having filled-via structure
- Patent number 7,071,424
- Issue date Jul 4, 2006
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing wiring board and method of producing the same and capacito...
- Patent number 6,876,554
- Issue date Apr 5, 2005
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of producing the same
- Patent number 6,724,638
- Issue date Apr 20, 2004
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 6,365,843
- Issue date Apr 2, 2002
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150250056
- Publication date Sep 3, 2015
- IIBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247572
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20130286615
- Publication date Oct 31, 2013
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130107482
- Publication date May 2, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
- Publication number 20120103680
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20120006469
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100328915
- Publication date Dec 30, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100226108
- Publication date Sep 9, 2010
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100118502
- Publication date May 13, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
- Publication number 20100101852
- Publication date Apr 29, 2010
- IBIDEN CO., LTD.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100014261
- Publication date Jan 21, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
- Publication number 20080264686
- Publication date Oct 30, 2008
- IBIDEN CO., LTD.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRUIT BOARD
- Publication number 20080169120
- Publication date Jul 17, 2008
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20080158841
- Publication date Jul 3, 2008
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20080158838
- Publication date Jul 3, 2008
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20080144298
- Publication date Jun 19, 2008
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20080142255
- Publication date Jun 19, 2008
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20080055872
- Publication date Mar 6, 2008
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRUIT BOARD
- Publication number 20070258225
- Publication date Nov 8, 2007
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer printed wiring board with filled viahole structure
- Publication number 20060159885
- Publication date Jul 20, 2006
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method for manufacturing printed circuit...
- Publication number 20050157478
- Publication date Jul 21, 2005
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer printed wiring board with filled viahole structure
- Publication number 20050100720
- Publication date May 12, 2005
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing printed circuit b...
- Publication number 20040160751
- Publication date Aug 19, 2004
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Seiji Shirai

Person

Patents Grantslast 30 patents

Printed circuit board

Multilayer printed wiring board with filled viahole structure

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board

Method of manufacturing printed wiring board

Printed circuit board

Printed circuit board

Multilayer printed wiring board with filled viahole structure

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Multilayer printed wiring board with filled viahole structure

Multilayer printed wiring board with filled viahole structure

Multilayer printed wiring board with filled viahole structure

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board and method for manufacturing printed circuit...

Multilayer printed wiring board having filled-via structure

Printing wiring board and method of producing the same and capacito...

Printed wiring board and method of producing the same

Multilayer printed wiring board

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD

MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD

MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRUIT BOARD

Multilayer printed wiring board with filled viahole structure

Printed circuit board and method for manufacturing printed circuit...

Multilayer printed wiring board with filled viahole structure

Printed circuit board and method of manufacturing printed circuit b...