Seiji Ueno

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 9,425,088
- Issue date Aug 23, 2016
- SOCIONEXT INC.
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,564,121
- Issue date Oct 22, 2013
- Fujitsu Semiconductor Limited
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 8,446,020
- Issue date May 21, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having adhesive squeeze-out prevention conf...
- Patent number 8,421,219
- Issue date Apr 16, 2013
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having adhesive squeeze-out prevention conf...
- Patent number 7,999,374
- Issue date Aug 16, 2011
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,813,133
- Issue date Oct 12, 2010
- Fujitsu Semiconductor Limited
- Makoto Iijima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 6,841,819
- Issue date Jan 11, 2005
- Fujitsu Limited
- Takeyasu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an insulative substrate having conductive filled...
- Patent number 6,693,029
- Issue date Feb 17, 2004
- Fujitsu Limited
- Makoto Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,396,155
- Issue date May 28, 2002
- Fujitsu Limited
- Masaru Nukiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing substrate of the...
- Patent number 6,351,031
- Issue date Feb 26, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130224912
- Publication date Aug 29, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130164889
- Publication date Jun 27, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masanori NATSUAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120205789
- Publication date Aug 16, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Masanori NATSUAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120153448
- Publication date Jun 21, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR C...
- Publication number 20110254149
- Publication date Oct 20, 2011
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20110089579
- Publication date Apr 21, 2011
- Fujitsu Limited
- Masateru KOIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and manufacturing method of semiconductor c...
- Publication number 20100013089
- Publication date Jan 21, 2010
- FUJITSU LIMITED
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070139892
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030185068
- Publication date Oct 2, 2003
- Takeyasu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing substrate of the...
- Publication number 20030087483
- Publication date May 8, 2003
- FUJITSU LIMITED
- Makoto Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Multi-chip module

Semiconductor component having adhesive squeeze-out prevention conf...

Semiconductor component having adhesive squeeze-out prevention conf...

Semiconductor device

Semiconductor device

Method of forming an insulative substrate having conductive filled...

Semiconductor device and method of producing the same

Semiconductor device and method for manufacturing substrate of the...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR C...

MULTI-CHIP MODULE

Semiconductor component and manufacturing method of semiconductor c...

Semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing substrate of the...