Claims
- 1. A method for manufacturing a substrate, comprising:(a) adhering an adhesive layer to an organic insulation substrate to form a first part; (b) forming a via hole in the first part such that said via hole penetrates said first part; (c) forming a conductive metal film so that said conductive metal film covers said via-hole on one side of the first part; (d) using an electrolytic plating process, where said conductive metal film is used as an electrode, to form a metal via member within said via hole and to form an inter-layer wire; and (e) removing an entirety of said conductive metal film without removing said inter-layer formed by said electrolytic plating process; (f) repeating said steps (a)-(e) for a second part; and (g) thereafter attaching the first part to the second part.
- 2. The manufacturing method as claimed in claim 1, wherein said step of forming said via-holes is performed by a laser process.
- 3. The manufacturing method as claimed in claim 1, wherein said via-holes are shaped like truncated cones.
- 4. The manufacturing method as claimed in claim 3, wherein said truncated via-holes have vertical angles ranging from 10° to 90°.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-289937 |
Oct 1999 |
JP |
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Parent Case Info
This application is a division of prior application Ser. No. 09/533,173, filed Mar. 22, 2000, is now a U.S. Pat. No. 6,351,031.
US Referenced Citations (21)
Foreign Referenced Citations (3)
Number |
Date |
Country |
60-16701 |
Jan 1985 |
JP |
62-156847 |
Jul 1987 |
JP |
11-54934 |
Feb 1999 |
JP |