Seijiro SUNAGA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding device and ultrasonic bonding method
- Patent number 11,541,477
- Issue date Jan 3, 2023
- TDK Corporation
- Seijiro Sunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic...
- Patent number 11,267,071
- Issue date Mar 8, 2022
- TDK Corporation
- Seijiro Sunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing element array and apparatus for removin...
- Patent number 11,167,541
- Issue date Nov 9, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing element array and method of removing specif...
- Patent number 11,101,317
- Issue date Aug 24, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230382070
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B30 - PRESSES
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230381904
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD
- Publication number 20230187258
- Publication date Jun 15, 2023
- TDK Corporation
- Seijiro SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MUL...
- Publication number 20230140856
- Publication date May 11, 2023
- TDK Corporation
- Seijiro SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFA...
- Publication number 20230093241
- Publication date Mar 23, 2023
- TDK Corporation
- Hiroshi KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELEMENT ARRAY AND METHOD OF REMOVING SPECIF...
- Publication number 20200227468
- Publication date Jul 16, 2020
- TDK Corporation
- Toshinobu MIYAGOSHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS FOR MANUFACTURING ELEMENT ARRAY AND APPARATUS FOR REMOVIN...
- Publication number 20200215809
- Publication date Jul 9, 2020
- TDK Corporation
- Toshinobu MIYAGOSHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ULTRASONIC BONDING HEAD, ULTRASONIC BONDING DEVICE, AND ULTRASONIC...
- Publication number 20200001391
- Publication date Jan 2, 2020
- TDK Corporation
- Seijiro SUNAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD
- Publication number 20190375041
- Publication date Dec 12, 2019
- TDK Corporation
- Seijiro SUNAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Seijiro SUNAGA

Person

Patents Grantslast 30 patents

Ultrasonic bonding device and ultrasonic bonding method

Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic...

Apparatus for manufacturing element array and apparatus for removin...

Method of manufacturing element array and method of removing specif...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD

STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MUL...

ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFA...

METHOD OF MANUFACTURING ELEMENT ARRAY AND METHOD OF REMOVING SPECIF...

APPARATUS FOR MANUFACTURING ELEMENT ARRAY AND APPARATUS FOR REMOVIN...

ULTRASONIC BONDING HEAD, ULTRASONIC BONDING DEVICE, AND ULTRASONIC...

ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD