Seishi Kumamoto

Person

  • Kakogawa-shi, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FLUX FOR SOLDER PASTE, AND SOLDER PASTE

    • Publication number 20120291921
    • Publication date Nov 22, 2012
    • ARAKAWA CHEMICAL INDUSTRIES, LTD.
    • Eiji Iwamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER PASTE

    • Publication number 20120291922
    • Publication date Nov 22, 2012
    • ARAKAWA CHEMICAL INDUSTRIES, LTD.
    • Eiji Iwamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu...

    • Publication number 20070051201
    • Publication date Mar 8, 2007
    • HARIMA CHEMICALS, INC.
    • Eiichiro Matsubara
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    Solder deposition method and solder bump forming method

    • Publication number 20040209451
    • Publication date Oct 21, 2004
    • HARIMA CHEMICALS, INC.
    • Youichi Kukimoto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR