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Seishi Kumamoto
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Kakogawa-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu...
Patent number
7,503,958
Issue date
Mar 17, 2009
Harima Chemicals, Inc.
Eiichiro Matsubara
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Solder deposition method and solder bump forming method
Patent number
7,452,797
Issue date
Nov 18, 2008
Harima Chemicals, Inc.
Youichi Kukimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder-precipitating composition and mounting method using the comp...
Patent number
5,601,228
Issue date
Feb 11, 1997
The Furukawa Electric Co., Ltd.
Takao Fukunaga
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board to be precoated with solder layers and solder circuit...
Patent number
5,453,582
Issue date
Sep 26, 1995
The Furukawa Electric Co., Ltd.
Toshiaki Amano
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
FLUX FOR SOLDER PASTE, AND SOLDER PASTE
Publication number
20120291921
Publication date
Nov 22, 2012
ARAKAWA CHEMICAL INDUSTRIES, LTD.
Eiji Iwamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER PASTE
Publication number
20120291922
Publication date
Nov 22, 2012
ARAKAWA CHEMICAL INDUSTRIES, LTD.
Eiji Iwamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu...
Publication number
20070051201
Publication date
Mar 8, 2007
HARIMA CHEMICALS, INC.
Eiichiro Matsubara
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Solder deposition method and solder bump forming method
Publication number
20040209451
Publication date
Oct 21, 2004
HARIMA CHEMICALS, INC.
Youichi Kukimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR