Sen Mao

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die package
- Patent number 9,966,330
- Issue date May 8, 2018
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 9,093,359
- Issue date Jul 28, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,928,138
- Issue date Jan 6, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages including die and L-shaped lead and method o...
- Patent number 8,586,419
- Issue date Nov 19, 2013
- Vishay Siliconix
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,471,381
- Issue date Jun 25, 2013
- Vishay Siliconix
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor package including die interposed between cup-shaped l...
- Patent number 7,394,150
- Issue date Jul 1, 2008
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including die interpose...
- Patent number 7,238,551
- Issue date Jul 3, 2007
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having slots in a die pad
- Patent number 6,744,119
- Issue date Jun 1, 2004
- Siliconix (Taiwan) Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 6,414,362
- Issue date Jul 2, 2002
- Siliconx (Taiwan) Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20170162403
- Publication date Jun 8, 2017
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20150331438
- Publication date Nov 19, 2015
- VISHAY-SILICONIX
- King Owyang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK DIE PACKAGE
- Publication number 20140264804
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Including Die and L-Shaped Lead and Method o...
- Publication number 20110175217
- Publication date Jul 21, 2011
- VISHAY-SILICONIX
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20100219519
- Publication date Sep 2, 2010
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063341
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063340
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor package including die interposed between cup-shaped l...
- Publication number 20060108671
- Publication date May 25, 2006
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor package including die interpose...
- Publication number 20060110856
- Publication date May 25, 2006
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe having slots in a die pad
- Publication number 20020056894
- Publication date May 16, 2002
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device
- Publication number 20010052641
- Publication date Dec 20, 2001
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for fabricating stack die package

Stack die package

Method for fabricating stack die package

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

Semiconductor packages including die and L-shaped lead and method o...

Complete power management system implemented in a single surface mo...

Semiconductor package including die interposed between cup-shaped l...

Method of fabricating semiconductor package including die interpose...

Leadframe having slots in a die pad

Power semiconductor device

Patents Applicationslast 30 patents

METHOD FOR FABRICATING STACK DIE PACKAGE

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

METHOD FOR FABRICATING STACK DIE PACKAGE

STACK DIE PACKAGE

Semiconductor Packages Including Die and L-Shaped Lead and Method o...

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

Semiconductor package including die interposed between cup-shaped l...

Method of fabricating semiconductor package including die interpose...

Leadframe having slots in a die pad

Power semiconductor device