Seok Goh

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting semiconductor device
- Patent number 9,130,011
- Issue date Sep 8, 2015
- Samsung Electronics Co., Ltd.
- Taehyun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test socket, and test apparatus with test socket to control a tempe...
- Patent number 8,564,317
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Jong-Won Han
- G01 - MEASURING TESTING
Information Patent Grant
Stacked package including spacers and method of manufacturing the same
- Patent number 8,546,938
- Issue date Oct 1, 2013
- Samsung Electronics Co., Ltd.
- Sang-Geun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having step type die and method for manufactu...
- Patent number 7,485,955
- Issue date Feb 3, 2009
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing wafer ring tape
- Patent number 6,698,486
- Issue date Mar 2, 2004
- Samsung Electronics Co., Ltd.
- Seok Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink to semiconductor module assembly equipment and method
- Patent number 6,408,507
- Issue date Jun 25, 2002
- Samsung Electronics Co., Ltd.
- Seok Goh
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Module appearance inspection apparatus
- Patent number 6,343,503
- Issue date Feb 5, 2002
- Samsung Electronics Co., Ltd.
- Seok Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED PACKAGE INCLUDING SPACERS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140015129
- Publication date Jan 16, 2014
- Samsung Electronics Co., Ltd.
- Sang-Geun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE WINDING UNIT AND APPARATUS OF PACKING SEMICONDUCTOR PA...
- Publication number 20130074447
- Publication date Mar 28, 2013
- Samsung Electronics Co., Ltd.
- Ki-hun Kim
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120205795
- Publication date Aug 16, 2012
- Samsung Electronics Co., Ltd.
- Sang-Geun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20110232082
- Publication date Sep 29, 2011
- TAEHYUN KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR SEMICONDUCTOR DIE BONDING
- Publication number 20110079361
- Publication date Apr 7, 2011
- Byeong-kuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SOCKET, TEST APPARATUS WITH TEST SOCKET
- Publication number 20100164525
- Publication date Jul 1, 2010
- Samsung Electronics Co., Ltd.
- Jongwong HAN
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package having step type die and method for manufactu...
- Publication number 20050205975
- Publication date Sep 22, 2005
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dicing semiconductor wafer
- Publication number 20040185580
- Publication date Sep 23, 2004
- Seok Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for removing wafer ring tape
- Publication number 20020070302
- Publication date Jun 13, 2002
- Samsung Electronics Co., Ltd.
- Seok Goh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus for mounting semiconductor device

Test socket, and test apparatus with test socket to control a tempe...

Stacked package including spacers and method of manufacturing the same

Semiconductor package having step type die and method for manufactu...

Apparatus for removing wafer ring tape

Heat sink to semiconductor module assembly equipment and method

Module appearance inspection apparatus

Patents Applicationslast 30 patents

STACKED PACKAGE INCLUDING SPACERS AND METHOD OF MANUFACTURING THE SAME

CARRIER TAPE WINDING UNIT AND APPARATUS OF PACKING SEMICONDUCTOR PA...

STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE

APPARATUS FOR SEMICONDUCTOR DIE BONDING

TEST SOCKET, TEST APPARATUS WITH TEST SOCKET

Semiconductor package having step type die and method for manufactu...

Method for dicing semiconductor wafer

Apparatus for removing wafer ring tape