Seokho Kim

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,841
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,966
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,749,587
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatus and wafer to wafer bonding method
- Patent number 11,728,197
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jaehyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,616,036
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,607
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,362,067
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including bonding layer and adsorption layer
- Patent number 11,348,892
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,296,045
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 10,923,452
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus having adsorption sectors with differen...
- Patent number 10,411,062
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Jun Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 10,109,665
- Issue date Oct 23, 2018
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including protected barrier layers
- Patent number 8,564,139
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038141
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240274593
- Publication date Aug 15, 2024
- Samsung Electronics Co., LTD
- Seongmin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240234377
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136334
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240038708
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- KUNSANG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030083
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230238343
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING CHAMBER
- Publication number 20230178345
- Publication date Jun 8, 2023
- Kyoungran Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005853
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Kunsang PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336330
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER
- Publication number 20220293549
- Publication date Sep 15, 2022
- SAMSUNG ELECATRONICS CO., LTD.
- Jaehyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220208706
- Publication date Jun 30, 2022
- Samsung Electronics Co.,Ltd.
- Joohee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20220199670
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Dongyoung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220093567
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD
- Publication number 20220020624
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Jaehyun PHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220013502
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210375722
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066224
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210066250
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20210057371
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20200373274
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20180122845
- Publication date May 3, 2018
- Samsung Electronics Co., Ltd.
- Jun Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180053797
- Publication date Feb 22, 2018
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING STACKED STRUCTURES AND METHODS FOR FAB...
- Publication number 20160155724
- Publication date Jun 2, 2016
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Protected Barrier Layers
- Publication number 20130134603
- Publication date May 30, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONNECTION TERMINAL
- Publication number 20100190333
- Publication date Jul 29, 2010
- Samsung Electronics Co., Ltd.
- Myeong-Soon PARK
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor packages

Semiconductor packages

Method of manufacturing a semiconductor device including bonding la...

Semiconductor device

Wafer to wafer bonding apparatus and wafer to wafer bonding method

Semiconductor package for improving bonding reliability

Semiconductor device and method of manufacturing the same

Semiconductor device

Methods of manufacturing semiconductor devices

Semiconductor devices including bonding layer and adsorption layer

Semiconductor device and method of manufacturing the same

Substrate bonding apparatus

Substrate bonding apparatus having adsorption sectors with differen...

Semiconductor device and method of fabricating the same

Semiconductor devices having stacked structures and methods for fab...

Semiconductor devices including protected barrier layers

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF CLEANING CHAMBER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES

SUBSTRATE BONDING APPARATUS

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES HAVING STACKED STRUCTURES AND METHODS FOR FAB...

Semiconductor Devices Including Protected Barrier Layers

METHOD OF FORMING CONNECTION TERMINAL