Seong Kwon CHIN

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Acrylic binder and multilayer electronic component using the same
- Patent number 11,004,611
- Issue date May 11, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yu Ra Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive powder for inner electrode and capacitor
- Patent number 10,892,092
- Issue date Jan 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Gi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic binder and multilayer electronic component using the same
- Patent number 10,763,044
- Issue date Sep 1, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yu Ra Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic binder and multilayer electronic component using the same
- Patent number 10,403,436
- Issue date Sep 3, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yu Ra Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive powder for inner electrode and capacitor
- Patent number 10,290,423
- Issue date May 14, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Gi Kim
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Composite electronic component
- Patent number 10,176,926
- Issue date Jan 8, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min Chin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Inductor and method for manufacturing the same
- Patent number 9,852,836
- Issue date Dec 26, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component and board having the same
- Patent number 9,583,251
- Issue date Feb 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Je Ik Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate for a semiconductor package
- Patent number 8,298,865
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Young Berm Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package
- Patent number 8,125,086
- Issue date Feb 28, 2012
- Hynix Semiconductor Inc.
- Young Berm Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIPER BLADE COATING COMPOSITION COMPRISING FUNCTIONALIZED GRAPHENE...
- Publication number 20240075905
- Publication date Mar 7, 2024
- BESTGRAPHENE CO., LTD
- Myeong Gi KIM
- B60 - VEHICLES IN GENERAL
Information Patent Application
ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME
- Publication number 20200357576
- Publication date Nov 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yu Ra SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME
- Publication number 20190341192
- Publication date Nov 7, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yu Ra SHIN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME
- Publication number 20180174756
- Publication date Jun 21, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yu Ra SHIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE POWDER FOR INNER ELECTRODE AND CAPACITOR
- Publication number 20180144863
- Publication date May 24, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Gi KIM
- C01 - INORGANIC CHEMISTRY
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20160343509
- Publication date Nov 24, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Seong Min CHIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR
- Publication number 20160104578
- Publication date Apr 14, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Bum Suk KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160086714
- Publication date Mar 24, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Je Ik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140266543
- Publication date Sep 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISI...
- Publication number 20130000965
- Publication date Jan 3, 2013
- Samsung Electro-Mechanics CO., LTD.
- Dong Joo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...
- Publication number 20120118495
- Publication date May 17, 2012
- Hynix Semiconductor Inc.
- Young Berm JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...
- Publication number 20090294972
- Publication date Dec 3, 2009
- Young Berm JUNG
- H01 - BASIC ELECTRIC ELEMENTS

Seong Kwon CHIN

Person

Patents Grantslast 30 patents

Acrylic binder and multilayer electronic component using the same

Conductive powder for inner electrode and capacitor

Acrylic binder and multilayer electronic component using the same

Acrylic binder and multilayer electronic component using the same

Conductive powder for inner electrode and capacitor

Composite electronic component

Inductor and method for manufacturing the same

Chip electronic component and board having the same

Method for manufacturing a substrate for a semiconductor package

Substrate for semiconductor package

Patents Applicationslast 30 patents

WIPER BLADE COATING COMPOSITION COMPRISING FUNCTIONALIZED GRAPHENE...

ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME

ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME

ACRYLIC BINDER AND MULTILAYER ELECTRONIC COMPONENT USING THE SAME

CONDUCTIVE POWDER FOR INNER ELECTRODE AND CAPACITOR

COMPOSITE ELECTRONIC COMPONENT

MULTI-LAYER CERAMIC CAPACITOR

CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISI...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...