SeonGoo Lee

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KyungKi-Do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Stackable semiconductor package having semiconductor chip within ce...
- Patent number 7,061,120
- Issue date Jun 13, 2006
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 6,830,955
- Issue date Dec 14, 2004
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having semiconductor chip within central aper...
- Patent number 6,762,078
- Issue date Jul 13, 2004
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board semiconductor package
- Patent number 6,512,288
- Issue date Jan 28, 2003
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 6,501,184
- Issue date Dec 31, 2002
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 6,395,578
- Issue date May 28, 2002
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stackable semiconductor package having semiconductor chip within ce...
- Publication number 20040175916
- Publication date Sep 9, 2004
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20030001285
- Publication date Jan 2, 2003
- Amkor Technology, Inc.
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Semiconductor Chip Within Central Aper...
- Publication number 20010005601
- Publication date Jun 28, 2001
- WonSun Shin
- H01 - BASIC ELECTRIC ELEMENTS