Ser Choong Chong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connection structure and method of forming the same
- Patent number 11,508,619
- Issue date Nov 22, 2022
- Agency for Science, Technology and Research
- Hongyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispenser arrangement for fluidic dispensing control in microfluidi...
- Patent number 8,127,794
- Issue date Mar 6, 2012
- Agency for Science, Technology and Research
- Ling Xie
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Sensor array integrated electrochemical chip, method of forming sam...
- Patent number 7,547,381
- Issue date Jun 16, 2009
- Agency for Science, Technology and Research and National University of Singapore
- Yu Chen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200411379
- Publication date Dec 31, 2020
- Agency for Science, Technology and Research
- Hongyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming the Same
- Publication number 20130001795
- Publication date Jan 3, 2013
- Agency For Science, Technology and Research
- Teck Guan LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPENSER ARRANGEMENT FOR FLUIDIC DISPENSING CONTROL IN MICROFLUIDI...
- Publication number 20100084032
- Publication date Apr 8, 2010
- Agency for Science, Technology and Research
- Ling Xie
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
Microfluidics Package and Method of Fabricating the Same
- Publication number 20080199362
- Publication date Aug 21, 2008
- Agency for Science, Technology and Research
- Ser Choong Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a surface mountable IC and its assembly
- Publication number 20060057763
- Publication date Mar 16, 2006
- Agency For Science, Technology and Research
- Poi Siong Teo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Sensor array integrated electrochemical chip, method of forming sam...
- Publication number 20050067279
- Publication date Mar 31, 2005
- Agency For Science, Technology and Research
- Yu Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Ser Choong Chong

Person

Patents Grantslast 30 patents

Electrical connection structure and method of forming the same

Dispenser arrangement for fluidic dispensing control in microfluidi...

Sensor array integrated electrochemical chip, method of forming sam...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

Wafer Level Package and a Method of Forming the Same

DISPENSER ARRANGEMENT FOR FLUIDIC DISPENSING CONTROL IN MICROFLUIDI...

Microfluidics Package and Method of Fabricating the Same

Method of forming a surface mountable IC and its assembly

Sensor array integrated electrochemical chip, method of forming sam...