SeungJae Lee

Person

Pasadena, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuits with controlled collapse chip connections
- Patent number 12,218,479
- Issue date Feb 4, 2025
- SeungJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical engine
- Patent number 11,573,387
- Issue date Feb 7, 2023
- Rockley Photonics Limited
- Brett Sawyer
- G02 - OPTICS
Information Patent Grant
Fan-out package with rabbet
- Patent number 11,387,186
- Issue date Jul 12, 2022
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with rabbet
- Patent number 11,342,270
- Issue date May 24, 2022
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 11,054,597
- Issue date Jul 6, 2021
- Rockley Photonics Limited
- Vivek Raghunathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-packaged optics and transceiver
- Patent number 10,962,728
- Issue date Mar 30, 2021
- Rockley Photonics Limited
- David Arlo Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 10,921,538
- Issue date Feb 16, 2021
- Rockley Photonics Limited
- Vivek Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC INTEGRATED CIRCUITS WITH CONTROLLED COLLAPSE CHIP CONNECTIONS
- Publication number 20250149850
- Publication date May 8, 2025
- Apple Inc.
- SeungJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION...
- Publication number 20230343686
- Publication date Oct 26, 2023
- ROCKLEY PHOTONICS LIMITED
- SEUNGJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICONIZED HETEROGENEOUS OPTICAL ENGINE
- Publication number 20220336433
- Publication date Oct 20, 2022
- ROCKLEY PHOTONICS LIMITED
- SEUNGJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD VIA FRAME
- Publication number 20220319971
- Publication date Oct 6, 2022
- ROCKLEY PHOTONICS LIMITED
- SEUNGJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Integrated Circuits with Controlled Collapse Chip Connections
- Publication number 20220021179
- Publication date Jan 20, 2022
- Apple Inc.
- SeungJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENGINE
- Publication number 20200225430
- Publication date Jul 16, 2020
- ROCKLEY PHOTONICS LIMITED
- Brett Sawyer
- G02 - OPTICS
Information Patent Application
CO-PACKAGED OPTICS AND TRANSCEIVER
- Publication number 20200219865
- Publication date Jul 9, 2020
- ROCKLEY PHOTONICS LIMITED
- David Arlo Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH RABBET
- Publication number 20200161243
- Publication date May 21, 2020
- ROCKLEY PHOTONICS LIMITED
- SEUNGJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION
- Publication number 20190317287
- Publication date Oct 17, 2019
- ROCKLEY PHOTONICS LIMITED
- Vivek Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS

SeungJae Lee

Person

Patents Grantslast 30 patents

Packaging of three-dimensional integrated circuit by encapsulation...

Through mold via frame

Siliconized heterogeneous optical engine

Photonic integrated circuits with controlled collapse chip connections

Optical engine

Fan-out package with rabbet

Fan-out package with rabbet

Electro-optical package and method of fabrication

Co-packaged optics and transceiver

Electro-optical package and method of fabrication

Patents Applicationslast 30 patents

PHOTONIC INTEGRATED CIRCUITS WITH CONTROLLED COLLAPSE CHIP CONNECTIONS

Chip Singulation Assisted Structures and Methods for Improving Bond...

PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION...

SILICONIZED HETEROGENEOUS OPTICAL ENGINE

THROUGH MOLD VIA FRAME

Photonic Integrated Circuits with Controlled Collapse Chip Connections

OPTICAL ENGINE

CO-PACKAGED OPTICS AND TRANSCEIVER

FAN-OUT PACKAGE WITH RABBET

ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION