Seungwon Im

Person

Bucheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion direct cooling modules
- Patent number 12,230,551
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 11,658,171
- Issue date May 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 11,652,030
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,545,421
- Issue date Jan 3, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies and methods of manufacture
- Patent number 11,521,921
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,502,027
- Issue date Nov 15, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor package and related methods
- Patent number 11,264,311
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,145,571
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including a one-body clip
- Patent number 11,101,198
- Issue date Aug 24, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices
- Patent number 11,031,379
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 10,910,297
- Issue date Feb 2, 2021
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and manufacturing method
- Patent number 10,586,754
- Issue date Mar 10, 2020
- Semiconductor Components Industries, LLC (BHB)
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,403,601
- Issue date Sep 3, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 10,319,670
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices and mo...
- Patent number 10,090,279
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having stacked flip-chip and method for fabricating th...
- Patent number 9,130,065
- Issue date Sep 8, 2015
- Fairchild Korea Semiconductor, Ltd.
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20240282663
- Publication date Aug 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...
- Publication number 20240250042
- Publication date Jul 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240237216
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240194564
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240186218
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20240186211
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20240162110
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
- Publication number 20240162117
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Yoonsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...
- Publication number 20240136259
- Publication date Apr 25, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240138069
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240055334
- Publication date Feb 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240030108
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES
- Publication number 20230361011
- Publication date Nov 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
- Publication number 20230335459
- Publication date Oct 19, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20230327350
- Publication date Oct 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20230253393
- Publication date Aug 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20230253362
- Publication date Aug 10, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20230245953
- Publication date Aug 3, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20230225044
- Publication date Jul 13, 2023
- Semiconductor Components Industries, LLC
- Oseob JEON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
- Publication number 20220406684
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20220406744
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS

Seungwon Im

Person

Patents Grantslast 30 patents

High power module package structures

Semiconductor package and related methods

Immersion direct cooling modules

Power module and related methods

Submodule semiconductor package

Package including multiple semiconductor devices

Semiconductor packages using package in package systems and related...

Integrated circuit direct cooling systems having substrates in cont...

Integration of semiconductor device assemblies with thermal dissipa...

Semiconductor device package assemblies with direct leadframe attac...

Dual cool power module with stress buffer layer

Power module and related methods

Power module package and method of manufacturing the same

Package including multiple semiconductor devices

Semiconductor device package assemblies and methods of manufacture

Package including multiple semiconductor devices

Clips for semiconductor package and related methods

Semiconductor package having a spacer with a junction cooling pipe

Heat transfer for power modules

Semiconductor die package including a one-body clip

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices

Power module package

Package including multiple semiconductor devices

Semiconductor package having junction cooling pipes embedded in sub...

Semiconductor die package and manufacturing method

Semiconductor package and related methods

Package including multiple semiconductor devices

Stray inductance reduction in packaged semiconductor devices and mo...

Power module having stacked flip-chip and method for fabricating th...

Patents Applicationslast 30 patents

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

FLUIDIC-CHANNEL COOLED SUBSTRATES

MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE HAVING MIRRORED LEADS

INTEGRATED SUBSTRATES AND RELATED METHODS

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

MOLDED POWER MODULES

THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER

HIGH POWER MODULE PACKAGE STRUCTURES

POWER MODULE AND RELATED METHODS

STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

IMMERSION DIRECT COOLING MODULES AND RELATED METHODS

SUBMODULE SEMICONDUCTOR PACKAGE