Shaji Farooq

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,984,792
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection process for module assembly and rework
- Patent number 6,574,859
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Shaji Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,559,527
- Issue date May 6, 2003
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer and ceramic composite electronic substrates
- Patent number 6,528,145
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Daniel George Berger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decoupling capacitor method and structure using metal based carrier
- Patent number 6,461,493
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paste preforms as a heat transfer media between a chip and...
- Patent number 6,444,496
- Issue date Sep 3, 2002
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,358,439
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,300,164
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and applications of ball grid array interconn...
- Patent number 6,297,559
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal paste preforms as a heat transfer media between a chip and...
- Patent number 6,275,381
- Issue date Aug 14, 2001
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pluggable connector array and process thereof
- Patent number 6,271,111
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and process module assembly and rework
- Patent number 6,235,996
- Issue date May 22, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for a thin film multilayer capacitor
- Patent number 6,216,324
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,184,062
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 6,124,041
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,120,885
- Issue date Sep 19, 2000
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for a thin film multilayer capacitor
- Patent number 6,023,407
- Issue date Feb 8, 2000
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,985,128
- Issue date Nov 16, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,977,625
- Issue date Nov 2, 1999
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of a multi-component solder column by blockin...
- Patent number 5,961,032
- Issue date Oct 5, 1999
- International Business Machines Corporation
- James H. Covell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,935,404
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based paste containing copper aluminate for microstructural...
- Patent number 5,925,443
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Farid Youssif Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively depositing a metallic layer on a ceramic subs...
- Patent number 5,787,578
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,723,905
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dielectric interposer for chip to substrate soldering
- Publication number 20030193093
- Publication date Oct 16, 2003
- International Business Machines Corporation
- Peter J. Brofman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Process for forming cone shaped solder for chip interconnection
- Publication number 20010015495
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection process for module assembly and rework
- Publication number 20010005314
- Publication date Jun 28, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Shaji Farooq

Person

Patents Grantslast 30 patents

Dielectric interposer for chip to substrate soldering

Interconnection process for module assembly and rework

Process for forming cone shaped solder for chip interconnection

Polymer and ceramic composite electronic substrates

Decoupling capacitor method and structure using metal based carrier

Thermal paste preforms as a heat transfer media between a chip and...

Copper-based paste containing copper aluminate for microstructural...

Electrical interconnection package and method thereof

Structure, materials, and methods for socketable ball grid

Structure, materials, and applications of ball grid array interconn...

Method for enhancing fatigue life of ball grid arrays

Thermal paste preforms as a heat transfer media between a chip and...

High density pluggable connector array and process thereof

Interconnection structure and process module assembly and rework

Method for a thin film multilayer capacitor

Process for forming cone shaped solder for chip interconnection

Method for enhancing fatigue life of ball grid arrays

Copper-based paste containing copper aluminate for microstructural...

Structure, materials, and methods for socketable ball grid

Structure for a thin film multilayer capacitor

Method of performing processes on features with electricity

Semiconductor package with low strain seal

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Method of fabrication of a multi-component solder column by blockin...

Method of performing processes on features with electricity

Copper-based paste containing copper aluminate for microstructural...

Method of selectively depositing a metallic layer on a ceramic subs...

Semiconductor package with low strain seal

Patents Applicationslast 30 patents

Dielectric interposer for chip to substrate soldering

Process for forming cone shaped solder for chip interconnection

Interconnection process for module assembly and rework