Shakti S. Chauhan

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat exchange assembly and an associated method thereof
- Patent number 10,667,429
- Issue date May 26, 2020
- General Electric Company
- Shakti Singh Chauhan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Stacked printed circuit board packages
- Patent number 10,631,410
- Issue date Apr 21, 2020
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less integrated components
- Patent number 10,535,611
- Issue date Jan 14, 2020
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,522,475
- Issue date Dec 31, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,269,688
- Issue date Apr 23, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,186,477
- Issue date Jan 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package devices with magnetic shielding
- Patent number 10,147,685
- Issue date Dec 4, 2018
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,115,677
- Issue date Oct 30, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self shielded system in package (SiP) modules
- Patent number 10,109,593
- Issue date Oct 23, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay circuit structure for interconnecting light emitting semico...
- Patent number 10,070,531
- Issue date Sep 4, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
- Issue date Oct 31, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 9,721,903
- Issue date Aug 1, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 9,704,788
- Issue date Jul 11, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface devices
- Patent number 9,615,486
- Issue date Apr 4, 2017
- General Electric Company
- Hendrik Pieter Jacobus De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High specific area composite foam and an associated method of fabri...
- Patent number 9,534,855
- Issue date Jan 3, 2017
- General Electric Company
- Shakti Singh Chauhan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,391,027
- Issue date Jul 12, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assembly and method of manufacturing thereof
- Patent number 9,370,090
- Issue date Jun 14, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics chassis and method of fabricating the same
- Patent number 9,333,599
- Issue date May 10, 2016
- General Electric Company
- Hendrik Pieter Jacobus de Bock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion barrier for surface mount modules
- Patent number 9,299,630
- Issue date Mar 29, 2016
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assembly and method of fabricating the same
- Patent number 9,253,871
- Issue date Feb 2, 2016
- General Electric Company
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,209,151
- Issue date Dec 8, 2015
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable surface mount integrated power module
- Patent number 9,184,124
- Issue date Nov 10, 2015
- General Electric Company
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay circuit structure for interconnecting light emitting semico...
- Patent number 9,066,443
- Issue date Jun 23, 2015
- General Electric Company
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power overlay structure and method of making same
- Patent number 8,987,876
- Issue date Mar 24, 2015
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable surface mount integrated power module
- Patent number 8,941,208
- Issue date Jan 27, 2015
- General Electric Company
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchange assembly and methods of assembling same
- Patent number 8,811,014
- Issue date Aug 19, 2014
- General Electric Company
- Shakti Singh Chauhan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heat exchange assembly for use with electrical devices and methods...
- Patent number 8,780,559
- Issue date Jul 15, 2014
- General Electric Company
- Stanton Earl Weaver
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20190027445
- Publication date Jan 24, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PRINTED CIRCUIT BOARD PACKAGES
- Publication number 20180092213
- Publication date Mar 29, 2018
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT EXCHANGE ASSEMBLY AND AN ASSOCIATED METHOD THEREOF
- Publication number 20170374764
- Publication date Dec 28, 2017
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20170301631
- Publication date Oct 19, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-Package Devices With Magnetic Shielding
- Publication number 20170263569
- Publication date Sep 14, 2017
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170263539
- Publication date Sep 14, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARD ASSEMBLY WITH THERMAL ENERGY REMOVAL
- Publication number 20170251572
- Publication date Aug 31, 2017
- GE INTELLIGENT PLATFORMS, INC.
- Graham Charles KIRK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...
- Publication number 20170179039
- Publication date Jun 22, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTEGRATED COMPONENTS
- Publication number 20170148744
- Publication date May 25, 2017
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170077014
- Publication date Mar 16, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES
- Publication number 20170025361
- Publication date Jan 26, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEAL...
- Publication number 20160169594
- Publication date Jun 16, 2016
- GE INTELLIGENT PLATFORMS, INC.
- Hendrik Pieter Jacobus DE BOCK
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH SPECIFIC AREA COMPOSITE FOAM AND AN ASSOCIATED METHOD OF FABRI...
- Publication number 20160146556
- Publication date May 26, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF
- Publication number 20160095199
- Publication date Mar 31, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY
- Publication number 20160021788
- Publication date Jan 21, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150380356
- Publication date Dec 31, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE DEVICES
- Publication number 20150282380
- Publication date Oct 1, 2015
- GENERAL ELECTRIC COMPANY
- Hendrik Pieter Jacobus De Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20150255418
- Publication date Sep 10, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20150194375
- Publication date Jul 9, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME
- Publication number 20150181763
- Publication date Jun 25, 2015
- GENERAL ELECTRIC COMPANY
- Hendrik Pieter Jacobus de Bock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated heat exchange assembly and an associated method thereof
- Publication number 20150173243
- Publication date Jun 18, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME
- Publication number 20150116940
- Publication date Apr 30, 2015
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...
- Publication number 20150108513
- Publication date Apr 23, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCI...
- Publication number 20150090428
- Publication date Apr 2, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150084207
- Publication date Mar 26, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE
- Publication number 20150069612
- Publication date Mar 12, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER DEVICE AND AN ASSOCIATED METHOD OF FABRICATION
- Publication number 20150060021
- Publication date Mar 5, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20140264800
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Shakti S. Chauhan

Person

Patents Grantslast 30 patents

Ultra-thin embedded semiconductor device package and method of manu...

Integrated heat exchange assembly and an associated method thereof

Stacked printed circuit board packages

Ultra-thin embedded semiconductor device package and method of manu...

Substrate-less integrated components

Vertical interconnects for self shielded system in package (SiP) mo...

Power overlay structure and method of making same

Power overlay structure and method of making same

System-in-package devices with magnetic shielding

Vertical interconnects for self shielded system in package (SiP) mo...

Self shielded system in package (SiP) modules

Overlay circuit structure for interconnecting light emitting semico...

Ultra-thin embedded semiconductor device package and method of manu...

Vertical interconnects for self shielded system in package (SiP) mo...

Power overlay structure and method of making same

Thermal interface devices

High specific area composite foam and an associated method of fabri...

Embedded semiconductor device package and method of manufacturing t...

Circuit card assembly and method of manufacturing thereof

Electronics chassis and method of fabricating the same

Diffusion barrier for surface mount modules

Circuit card assembly and method of fabricating the same

Embedded semiconductor device package and method of manufacturing t...

Reliable surface mount integrated power module

Overlay circuit structure for interconnecting light emitting semico...

Power overlay structure and method of making same

Reliable surface mount integrated power module

Heat exchange assembly and methods of assembling same

Heat exchange assembly for use with electrical devices and methods...

Patents Applicationslast 30 patents

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

STACKED PRINTED CIRCUIT BOARD PACKAGES

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

INTEGRATED HEAT EXCHANGE ASSEMBLY AND AN ASSOCIATED METHOD THEREOF

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

System-in-Package Devices With Magnetic Shielding

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

CIRCUIT CARD ASSEMBLY WITH THERMAL ENERGY REMOVAL

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...

SUBSTRATE-LESS INTEGRATED COMPONENTS

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES

HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEAL...

HIGH SPECIFIC AREA COMPOSITE FOAM AND AN ASSOCIATED METHOD OF FABRI...

CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

ELECTRONIC DEVICE ASSEMBLY

EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...

THERMAL INTERFACE DEVICES

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME

Integrated heat exchange assembly and an associated method thereof

CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME

OVERLAY CIRCUIT STRUCTURE FOR INTERCONNECTING LIGHT EMITTING SEMICO...

HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCI...

EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...

RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE

HEAT TRANSFER DEVICE AND AN ASSOCIATED METHOD OF FABRICATION

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME