Shankar Ganapathysubramanian

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die warpage control for thin die assembly
- Patent number 9,659,899
- Issue date May 23, 2017
- Intel Corporation
- Sandeep B. Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and die spacer layers having a ceramic backbone
- Patent number 9,258,880
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die warpage control for thin die assembly
- Patent number 9,123,732
- Issue date Sep 1, 2015
- Intel Corporation
- Sandeep B. Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and die spacer layers having a ceramic backbone
- Patent number 8,604,353
- Issue date Dec 10, 2013
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Treatment for a microelectronic device and method of resisting dama...
- Patent number 8,304,065
- Issue date Nov 6, 2012
- Leonel Arana
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating package substrate and die spacer layers havi...
- Patent number 8,186,051
- Issue date May 29, 2012
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package with wear resistant coating
- Patent number 7,759,780
- Issue date Jul 20, 2010
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded capacitors for reducing package cracking
- Patent number 7,719,109
- Issue date May 18, 2010
- Intel Corporation
- Mitul Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant structure for an electronic device, method of manufacturi...
- Patent number 7,692,307
- Issue date Apr 6, 2010
- Intel Corporation
- Sudarshan Rangaraj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY
- Publication number 20150318258
- Publication date Nov 5, 2015
- Intel Corporation
- SANDEEP B. SANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20130341076
- Publication date Dec 26, 2013
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20120152601
- Publication date Jun 21, 2012
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Use of die backside films to modulate EOL coplanarity of thin packa...
- Publication number 20110156283
- Publication date Jun 30, 2011
- Shankar Ganapathysubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment for a microelectronic device and method of resisting dama...
- Publication number 20110159256
- Publication date Jun 30, 2011
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate and die spacer layers having a ceramic backbone
- Publication number 20090242247
- Publication date Oct 1, 2009
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant structure for an electronic device, method of manufacturi...
- Publication number 20080137318
- Publication date Jun 12, 2008
- Sudarshan Rangaraj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded capacitors for reducing package cracking
- Publication number 20080096310
- Publication date Apr 24, 2008
- Mitul Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shape memory based mechanical enabling mechanism
- Publication number 20080079129
- Publication date Apr 3, 2008
- Shankar Ganapathysubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly having a periphery seal around a thermal i...
- Publication number 20080001282
- Publication date Jan 3, 2008
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS

Shankar Ganapathysubramanian

Person

Patents Grantslast 30 patents

Die warpage control for thin die assembly

Package substrate and die spacer layers having a ceramic backbone

Die warpage control for thin die assembly

Package substrate and die spacer layers having a ceramic backbone

Treatment for a microelectronic device and method of resisting dama...

Method for fabricating package substrate and die spacer layers havi...

Microelectronic package with wear resistant coating

Embedded capacitors for reducing package cracking

Compliant structure for an electronic device, method of manufacturi...

Patents Applicationslast 30 patents

DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY

Package substrate and die spacer layers having a ceramic backbone

Package substrate and die spacer layers having a ceramic backbone

Use of die backside films to modulate EOL coplanarity of thin packa...

Treatment for a microelectronic device and method of resisting dama...

Package substrate and die spacer layers having a ceramic backbone

Compliant structure for an electronic device, method of manufacturi...

Embedded capacitors for reducing package cracking

Shape memory based mechanical enabling mechanism

Microelectronic assembly having a periphery seal around a thermal i...