Shantanu Kalchuri

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal performance of logic chip in a package-on-package structure
- Patent number 10,096,534
- Issue date Oct 9, 2018
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,032,692
- Issue date Jul 24, 2018
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile chip package with modified heat spreader
- Patent number 9,530,714
- Issue date Dec 27, 2016
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and computer program product for affixing a post to...
- Patent number 9,087,830
- Issue date Jul 21, 2015
- NVIDIA Corporation
- Leilei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FERROMAGNETIC MATERIAL BASED INTEGRATED INDUCTOR IN SILICON
- Publication number 20240379731
- Publication date Nov 14, 2024
- NVIDIA Corp.
- Padam Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20140264816
- Publication date Sep 18, 2014
- NVIDIA Corporation
- Shantanu Kalchuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE CHIP PACKAGE WITH MODIFIED HEAT SPREADER
- Publication number 20140167216
- Publication date Jun 19, 2014
- NVIDIA Corporation
- Shantanu KALCHURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE OF LOGIC CHIP IN A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20140131847
- Publication date May 15, 2014
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAG...
- Publication number 20140133105
- Publication date May 15, 2014
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR PREPARING A SUBSTR...
- Publication number 20130256873
- Publication date Oct 3, 2013
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR AFFIXING A POST TO...
- Publication number 20130252414
- Publication date Sep 26, 2013
- NVIDIA Corporation
- Leilei Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Shantanu Kalchuri

Person

Patents Grantslast 30 patents

Thermal performance of logic chip in a package-on-package structure

Semiconductor package structure

Low-profile chip package with modified heat spreader

System, method, and computer program product for affixing a post to...

Patents Applicationslast 30 patents

FERROMAGNETIC MATERIAL BASED INTEGRATED INDUCTOR IN SILICON

SEMICONDUCTOR PACKAGE STRUCTURE

LOW-PROFILE CHIP PACKAGE WITH MODIFIED HEAT SPREADER

THERMAL PERFORMANCE OF LOGIC CHIP IN A PACKAGE-ON-PACKAGE STRUCTURE

METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAG...

SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR PREPARING A SUBSTR...

SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR AFFIXING A POST TO...