Shao Beng Law

Person

Watervliet, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Line end structures for semiconductor devices
- Patent number 10,770,392
- Issue date Sep 8, 2020
- GLOBALFOUNDRIES Inc.
- Nicholas V. Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to reduce shorts and contact resistance in sem...
- Patent number 10,741,495
- Issue date Aug 11, 2020
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of protecting structure of integrated circuit from rework
- Patent number 10,636,656
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Lei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay mark structures
- Patent number 10,627,720
- Issue date Apr 21, 2020
- GLOBALFOUNDRIES Inc.
- Lei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal interconnects for super (skip) via integration
- Patent number 10,573,593
- Issue date Feb 25, 2020
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning with mandrel cuts formed using a block mask
- Patent number 10,395,926
- Issue date Aug 27, 2019
- GLOBALFOUNDRIES Inc.
- Minghao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-spacer self-aligned cut formation
- Patent number 10,236,256
- Issue date Mar 19, 2019
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,199,261
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-mandrel cut formation
- Patent number 10,163,633
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control during skip via formation
- Patent number 10,109,526
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lithographic patterning
- Patent number 10,056,292
- Issue date Aug 21, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post spacer self-aligned cuts
- Patent number 10,056,291
- Issue date Aug 21, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnects for super (skip) via integration
- Patent number 10,026,687
- Issue date Jul 17, 2018
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit structure using extreme ultra...
- Patent number 10,014,297
- Issue date Jul 3, 2018
- GLOBALFOUNDRIES Inc.
- Lei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-spacer self-aligned cut formation
- Patent number 9,966,338
- Issue date May 8, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned non-mandrel cut formation for tone inversion
- Patent number 9,905,424
- Issue date Feb 27, 2018
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via structures
- Patent number 9,805,972
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PROTECTING STRUCTURE OF INTEGRATED CIRCUIT FROM REWORK
- Publication number 20190318927
- Publication date Oct 17, 2019
- GLOBALFOUNDRIES INC.
- Lei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO REDUCE SHORTS AND CONTACT RESISTANCE IN SEM...
- Publication number 20190221523
- Publication date Jul 18, 2019
- GLOBALFOUNDRIES INC.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE STRUCTURES WITH AIR GAPS
- Publication number 20190206718
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY MARK STRUCTURES
- Publication number 20190056671
- Publication date Feb 21, 2019
- GLOBALFOUNDRIES INC.
- Lei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190027401
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-SPACER SELF-ALIGNED CUT FORMATION
- Publication number 20180301413
- Publication date Oct 18, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTS FOR SUPER (SKIP) VIA INTEGRATION
- Publication number 20180269150
- Publication date Sep 20, 2018
- GLOBALFOUNDRIES INC.
- Sean Xuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-MANDREL CUT FORMATION
- Publication number 20180261457
- Publication date Sep 13, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST SPACER SELF-ALIGNED CUTS
- Publication number 20180144976
- Publication date May 24, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LITHOGRAPHIC PATTERNING
- Publication number 20180144979
- Publication date May 24, 2018
- GLOBALFOUNDRIES INC.
- Shao Beng LAW
- H01 - BASIC ELECTRIC ELEMENTS

Shao Beng Law

Person

Patents Grantslast 30 patents

Line end structures for semiconductor devices

Structure and method to reduce shorts and contact resistance in sem...

Methods of protecting structure of integrated circuit from rework

Overlay mark structures

Metal interconnects for super (skip) via integration

Via and skip via structures

Multiple patterning with mandrel cuts formed using a block mask

Pre-spacer self-aligned cut formation

Via and skip via structures

Non-mandrel cut formation

Etch profile control during skip via formation

Self-aligned lithographic patterning

Post spacer self-aligned cuts

Metal interconnects for super (skip) via integration

Methods of forming integrated circuit structure using extreme ultra...

Pre-spacer self-aligned cut formation

Self-aligned non-mandrel cut formation for tone inversion

Skip via structures

Patents Applicationslast 30 patents

METHODS OF PROTECTING STRUCTURE OF INTEGRATED CIRCUIT FROM REWORK

STRUCTURE AND METHOD TO REDUCE SHORTS AND CONTACT RESISTANCE IN SEM...

BACK-END-OF-LINE STRUCTURES WITH AIR GAPS

OVERLAY MARK STRUCTURES

VIA AND SKIP VIA STRUCTURES

VIA AND SKIP VIA STRUCTURES

PRE-SPACER SELF-ALIGNED CUT FORMATION

METAL INTERCONNECTS FOR SUPER (SKIP) VIA INTEGRATION

NON-MANDREL CUT FORMATION

POST SPACER SELF-ALIGNED CUTS

SELF-ALIGNED LITHOGRAPHIC PATTERNING