Shao Hua CHANG

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus
- Patent number 12,180,606
- Issue date Dec 31, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting method for substrate and plating apparatus
- Patent number 12,152,311
- Issue date Nov 26, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 12,116,687
- Issue date Oct 15, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Air bubble removing method of plating apparatus and plating apparatus
- Patent number 12,077,875
- Issue date Sep 3, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, pre-wet process method, and cleaning process method
- Patent number 12,054,840
- Issue date Aug 6, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and film thickness measuring method for substrate
- Patent number 11,906,299
- Issue date Feb 20, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, processing apparatus having the paddle, and method of produ...
- Patent number 11,891,715
- Issue date Feb 6, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,846,035
- Issue date Dec 19, 2023
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plate, plating apparatus, and method of manufacturing plate
- Patent number 11,725,296
- Issue date Aug 15, 2023
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 11,717,796
- Issue date Aug 8, 2023
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating device and resistor
- Patent number 11,603,601
- Issue date Mar 14, 2023
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wet substrate processing device
- Patent number 11,447,883
- Issue date Sep 20, 2022
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 11,359,304
- Issue date Jun 14, 2022
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning device, plating device including the same, and cleaning me...
- Patent number 11,192,151
- Issue date Dec 7, 2021
- Ebara Corporation
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,098,413
- Issue date Aug 24, 2021
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 10,946,351
- Issue date Mar 16, 2021
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wave absorbing member attachable to paddle and plating apparatus in...
- Patent number 10,914,020
- Issue date Feb 9, 2021
- Ebara Corporation
- Shao Hua Chang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,914,019
- Issue date Feb 9, 2021
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20250003108
- Publication date Jan 2, 2025
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
- Publication number 20230167572
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
- Publication number 20230152077
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230151507
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING SOLUTION AGITATING METHOD
- Publication number 20220396896
- Publication date Dec 15, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD
- Publication number 20220396897
- Publication date Dec 15, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING PROCESS METHOD
- Publication number 20220356595
- Publication date Nov 10, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220267921
- Publication date Aug 25, 2022
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20220243356
- Publication date Aug 4, 2022
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220178046
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS AND PLATING APPARATUS
- Publication number 20220106701
- Publication date Apr 7, 2022
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATE, PLATING APPARATUS, AND METHOD OF MANUFACTURING PLATE
- Publication number 20210355596
- Publication date Nov 18, 2021
- EBARA CORPORATION
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING DEVICE AND RESISTOR
- Publication number 20210277533
- Publication date Sep 9, 2021
- EBARA CORPORATION
- MITSUHIRO SHAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...
- Publication number 20210262111
- Publication date Aug 26, 2021
- EBARA CORPORATION
- Yasuyuki Masuda
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
- Publication number 20210154629
- Publication date May 27, 2021
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET SUBSTRATE PROCESSING DEVICE
- Publication number 20200378021
- Publication date Dec 3, 2020
- EBARA CORPORATION
- SHAO HUA CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING DEVICE, PLATING DEVICE INCLUDING THE SAME, AND CLEANING ME...
- Publication number 20200108423
- Publication date Apr 9, 2020
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20190203374
- Publication date Jul 4, 2019
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS IN...
- Publication number 20190186038
- Publication date Jun 20, 2019
- EBARA CORPORATION
- SHAO HUA CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190127875
- Publication date May 2, 2019
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190112727
- Publication date Apr 18, 2019
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
- Publication number 20180221835
- Publication date Aug 9, 2018
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shao Hua CHANG

Person

Patents Grantslast 30 patents

Plating apparatus

Wetting method for substrate and plating apparatus

Plating apparatus and cleaning method of contact member of plating...

Powder supply apparatus and plating system

Air bubble removing method of plating apparatus and plating apparatus

Plating apparatus, pre-wet process method, and cleaning process method

Plating apparatus and film thickness measuring method for substrate

Paddle, processing apparatus having the paddle, and method of produ...

Plating apparatus and plating method

Plate, plating apparatus, and method of manufacturing plate

Paddle, plating apparatus equipped with the paddle, and plating method

Plating device and resistor

Wet substrate processing device

Powder supply apparatus and plating system

Cleaning device, plating device including the same, and cleaning me...

Plating apparatus and plating method

Paddle, plating apparatus equipped with the paddle, and plating method

Wave absorbing member attachable to paddle and plating apparatus in...

Plating apparatus and plating method

Patents Applicationslast 30 patents

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS

PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE

PLATING APPARATUS

PLATING APPARATUS AND PLATING SOLUTION AGITATING METHOD

PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD

PLATING APPARATUS AND PLATING PROCESS METHOD

PLATING APPARATUS AND PLATING METHOD

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

PLATING APPARATUS AND PLATING METHOD

AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS AND PLATING APPARATUS

PLATE, PLATING APPARATUS, AND METHOD OF MANUFACTURING PLATE

PLATING DEVICE AND RESISTOR

PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...

PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD

WET SUBSTRATE PROCESSING DEVICE

CLEANING DEVICE, PLATING DEVICE INCLUDING THE SAME, AND CLEANING ME...

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS IN...

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND PLATING METHOD

PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD