Shaoning Yuan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Crack-arresting structure for through-silicon vias
- Patent number 8,860,185
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shaoning Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV backside processing using copper damascene interconnect technology
- Patent number 8,466,062
- Issue date Jun 18, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yue Kang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for planarizing through-silicon vias
- Patent number 8,354,327
- Issue date Jan 15, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chen Zengxiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20140264733
- Publication date Sep 18, 2014
- GLOBALFOUNDERS Singapore Pte. Ltd.
- Shaoning YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crack-Arresting Structure for Through-Silicon Vias
- Publication number 20130187280
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shaoning Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Backside Processing Using Copper Damascene Interconnect Technology
- Publication number 20130105968
- Publication date May 2, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yue Kang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR PLANARIZING THROUGH-SILICON VIAS
- Publication number 20120270391
- Publication date Oct 25, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Chen Zengxiang
- H01 - BASIC ELECTRIC ELEMENTS