Sharma V. Pamarthy

Person

Hayward, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for high efficiency gas dissociation in induct...
- Patent number 9,070,633
- Issue date Jun 30, 2015
- Applied Materials, Inc.
- Roy C. Nangoy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post etch reactive plasma milling to smooth through substrate via s...
- Patent number 9,039,908
- Issue date May 26, 2015
- Applied Materials, Inc.
- Jon Farr
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for high efficiency gas dissociation in induct...
- Patent number 8,753,474
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Roy C. Nangoy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for etching high aspect ratio features
- Patent number 8,475,625
- Issue date Jul 2, 2013
- Applied Materials, Inc.
- Sharma Pamarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a deep trench in a substrate
- Patent number 8,158,522
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Khalid M. Sirajuddin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching multi-shaped openings in silicon
- Patent number 6,979,652
- Issue date Dec 27, 2005
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of releasing devices from a substrate
- Patent number 6,905,616
- Issue date Jun 14, 2005
- Applied Materials, Inc.
- Ajay Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for etching high-aspect-ratio features
- Patent number 6,897,155
- Issue date May 24, 2005
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching conductors at high etch rates
- Patent number 6,593,244
- Issue date Jul 15, 2003
- Applied Materials Inc.
- Yiqiong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR HIGH EFFICIENCY GAS DISSOCIATION IN INDUCT...
- Publication number 20140256148
- Publication date Sep 11, 2014
- Roy C. NANGOY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FILLING A DEEP TRENCH IN A SUBSTRATE
- Publication number 20110217832
- Publication date Sep 8, 2011
- Digvijay Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A DEEP TRENCH IN A SUBSTRATE
- Publication number 20110201205
- Publication date Aug 18, 2011
- Khalid M. Sirajuddin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR HIGH EFFICIENCY GAS DISSOCIATION IN INDUCT...
- Publication number 20110073564
- Publication date Mar 31, 2011
- Applied Materials, Inc.
- Roy C. Nangoy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Post etch reactive plasma milling to smooth through substrate via s...
- Publication number 20100055400
- Publication date Mar 4, 2010
- APPLIED MATERIALS, INC.
- Jon Farr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS
- Publication number 20090272717
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- Sharma V. Pamarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ETCHING HIGH ASPECT RATIO FEATURES
- Publication number 20070256785
- Publication date Nov 8, 2007
- Sharma Pamarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of releasing devices from a substrate
- Publication number 20040173575
- Publication date Sep 9, 2004
- Ajay Kumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for etching high-aspect-ratio features
- Publication number 20040033697
- Publication date Feb 19, 2004
- APPLIED MATERIALS, INC.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching multi-shaped openings in silicon
- Publication number 20030189024
- Publication date Oct 9, 2003
- Applied Materials Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing modulated bias power to a plasma...
- Publication number 20030153195
- Publication date Aug 14, 2003
- APPLIED MATERIALS, INC.
- Elisabeth Weikmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for increasing capacitance in stacked and trench capacitors
- Publication number 20030052088
- Publication date Mar 20, 2003
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS

Sharma V. Pamarthy

Person

Patents Grantslast 30 patents

Method and apparatus for high efficiency gas dissociation in induct...

Post etch reactive plasma milling to smooth through substrate via s...

Method and apparatus for high efficiency gas dissociation in induct...

Apparatus for etching high aspect ratio features

Method of forming a deep trench in a substrate

Etching multi-shaped openings in silicon

Method of releasing devices from a substrate

Method for etching high-aspect-ratio features

Process for etching conductors at high etch rates

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR HIGH EFFICIENCY GAS DISSOCIATION IN INDUCT...

METHOD OF FILLING A DEEP TRENCH IN A SUBSTRATE

METHOD OF FORMING A DEEP TRENCH IN A SUBSTRATE

METHOD AND APPARATUS FOR HIGH EFFICIENCY GAS DISSOCIATION IN INDUCT...

Post etch reactive plasma milling to smooth through substrate via s...

METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS

APPARATUS FOR ETCHING HIGH ASPECT RATIO FEATURES

Method of releasing devices from a substrate

Method for etching high-aspect-ratio features

Etching multi-shaped openings in silicon

Method and apparatus for providing modulated bias power to a plasma...

Method for increasing capacitance in stacked and trench capacitors