Sharon N. Farrens

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Davis, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
In situ plasma wafer bonding method
- Patent number 6,908,832
- Issue date Jun 21, 2005
- Silicon Genesis Corporation
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ plasma wafer bonding method
- Patent number 6,645,828
- Issue date Nov 11, 2003
- Silicon Genesis Corporation
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multi-layered substrates
- Patent number 6,534,381
- Issue date Mar 18, 2003
- Silicon Genesis Corporation
- Nathan W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ plasma wafer bonding method
- Patent number 6,180,496
- Issue date Jan 30, 2001
- Silicon Genesis Corporation
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
In situ plasma wafer bonding method
- Publication number 20040132304
- Publication date Jul 8, 2004
- Silicon Genesis Corporation
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MULTI-LAYERED SUBSTRATES
- Publication number 20030008475
- Publication date Jan 9, 2003
- NATHAN W. CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS