Shau Yi Chen

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Yunlin County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Die-bonded LED
- Patent number 8,716,737
- Issue date May 6, 2014
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonding method of LED chip and LED manufactured by the same
- Patent number 8,236,687
- Issue date Aug 7, 2012
- Industrial Technology Research Institute
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic apparatus for arc ion plating
- Patent number 5,976,636
- Issue date Nov 2, 1999
- Industrial Technology Research Institute
- Ming-Sheng Leu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND...
- Publication number 20130334561
- Publication date Dec 19, 2013
- Hsiu-Jen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDED LED
- Publication number 20120256228
- Publication date Oct 11, 2012
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACK PACKAGE LED
- Publication number 20110156071
- Publication date Jun 30, 2011
- Industrial Technology Research Institute
- Chia Shen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME
- Publication number 20110127563
- Publication date Jun 2, 2011
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS