Shaulin Shue

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
ECP polymer additives and method for reducing overburden and defects
- Patent number 7,182,849
- Issue date Feb 27, 2007
- Taiwan Semiconducotr Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electromigration inhibition by copper alloy formation
- Patent number 6,875,692
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to enhance the yield of copper interconnections
- Patent number 6,849,173
- Issue date Feb 1, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper damascene structure over tungsten plugs...
- Patent number 6,309,964
- Issue date Oct 30, 2001
- Taiwan Semiconductor Manufacturing Company
- Ming Hsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step deposition to improve the conformality of ionized PVD films
- Patent number 6,077,779
- Issue date Jun 20, 2000
- Taiwan Semiconductor Manufacturing Company
- Shaulin Shue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step plasma treatment process for forming low resistance tita...
- Patent number 5,970,378
- Issue date Oct 19, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shaulin Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating MOSFET devices
- Patent number 5,702,972
- Issue date Dec 30, 1997
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chaochieh Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of CVD TiN barrier layer integration
- Patent number 5,688,718
- Issue date Nov 18, 1997
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shaulin Shue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Composition and process for element displacement metal passivation
- Publication number 20060189131
- Publication date Aug 24, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical structures and compositions of ECP additives to reduce pit...
- Publication number 20050199507
- Publication date Sep 15, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ECP polymer additives and method for reducing overburden and defects
- Publication number 20050189233
- Publication date Sep 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Shaulin Shue

Person

Patents Grantslast 30 patents

ECP polymer additives and method for reducing overburden and defects

Copper electromigration inhibition by copper alloy formation

Technique to enhance the yield of copper interconnections

Method for forming a copper damascene structure over tungsten plugs...

Multi-step deposition to improve the conformality of ionized PVD films

Multi-step plasma treatment process for forming low resistance tita...

Method of fabricating MOSFET devices

Method of CVD TiN barrier layer integration

Patents Applicationslast 30 patents

Composition and process for element displacement metal passivation

Chemical structures and compositions of ECP additives to reduce pit...

ECP polymer additives and method for reducing overburden and defects