Shawn X. ARNOLD

Person

Santa Cruz, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low profile packaging and assembly of a power conversion system in...
- Patent number 10,932,366
- Issue date Feb 23, 2021
- Apple Inc.
- Sunil M. Akre
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Capacitive sensor packaging
- Patent number 10,783,347
- Issue date Sep 22, 2020
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection pad for embedded components in PCB packaging
- Patent number 10,455,707
- Issue date Oct 22, 2019
- Apple Inc.
- Kenneth Leland Kiplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensor packaging
- Patent number 10,423,815
- Issue date Sep 24, 2019
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Segmented via for vertical PCB interconnect
- Patent number 10,420,213
- Issue date Sep 17, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor structure with acoustic noise self-canceling characteristics
- Patent number 10,179,254
- Issue date Jan 15, 2019
- Apple Inc.
- Paul A. Martinez
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Capacitive sensor packaging
- Patent number 10,007,832
- Issue date Jun 26, 2018
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitive sensor packaging
- Patent number 10,007,833
- Issue date Jun 26, 2018
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low profile packaging and assembly of a power conversion system in...
- Patent number 9,936,579
- Issue date Apr 3, 2018
- Apple Inc.
- Sunil M. Akre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for observing an entire communication bus in operation
- Patent number 9,812,401
- Issue date Nov 7, 2017
- Apple Inc.
- Anne M. Mason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustically quiet capacitors
- Patent number 9,805,867
- Issue date Oct 31, 2017
- Apple Inc.
- Shawn X. Arnold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for observing an entire communication bus in operation
- Patent number 9,763,329
- Issue date Sep 12, 2017
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic capacitors with built-in EMI shield
- Patent number 9,715,964
- Issue date Jul 25, 2017
- Apple Inc.
- Gang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with magnetic sensors
- Patent number 9,664,747
- Issue date May 30, 2017
- Apple Inc.
- Henry H. Yang
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuits with embedded strain gauges
- Patent number 9,593,991
- Issue date Mar 14, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive sensor packaging
- Patent number 9,576,178
- Issue date Feb 21, 2017
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector having printed circuit with embedded die
- Patent number 9,455,539
- Issue date Sep 27, 2016
- Apple Inc.
- Corey N. Axelowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuits with embedded semiconductor dies
- Patent number 9,443,830
- Issue date Sep 13, 2016
- Apple Inc.
- Corey N. Axelowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a sensor array package
- Patent number 9,402,316
- Issue date Jul 26, 2016
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost repackaging of thinned integrated devices
- Patent number 9,330,943
- Issue date May 3, 2016
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low acoustic noise capacitors
- Patent number 9,287,049
- Issue date Mar 15, 2016
- Apple Inc.
- Gang Ning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive sensor packaging
- Patent number 9,268,989
- Issue date Feb 23, 2016
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Small form factor stacked electrical passive devices that reduce th...
- Patent number 9,215,807
- Issue date Dec 15, 2015
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna structures and shield layers on packaged wireless circuits
- Patent number 9,196,958
- Issue date Nov 24, 2015
- Apple Inc.
- Shawn Xavier Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter trench sensor array package
- Patent number 9,190,379
- Issue date Nov 17, 2015
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensor packaging
- Patent number 9,135,495
- Issue date Sep 15, 2015
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct multiple substrate die assembly
- Patent number 9,117,873
- Issue date Aug 25, 2015
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon shaping
- Patent number 9,053,952
- Issue date Jun 9, 2015
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive sensor packaging
- Patent number 9,030,440
- Issue date May 12, 2015
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low profile, space efficient circuit shields
- Patent number 9,030,841
- Issue date May 12, 2015
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Capacitive Sensor Packaging
- Publication number 20200110920
- Publication date Apr 9, 2020
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT
- Publication number 20190075653
- Publication date Mar 7, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20180276449
- Publication date Sep 27, 2018
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN...
- Publication number 20180228026
- Publication date Aug 9, 2018
- Apple Inc.
- Sunil M. Akre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CERAMIC CAPACITORS
- Publication number 20180144870
- Publication date May 24, 2018
- Apple Inc.
- Gang NING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PASSIVE COMPONENT STRUCTURES
- Publication number 20180061578
- Publication date Mar 1, 2018
- Apple Inc.
- Gang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20170351902
- Publication date Dec 7, 2017
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION
- Publication number 20170263561
- Publication date Sep 14, 2017
- Apple Inc.
- Anne M. Mason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION
- Publication number 20170265304
- Publication date Sep 14, 2017
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20170109565
- Publication date Apr 20, 2017
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR STRUCTURE WITH ACOUSTIC NOISE SELF-CANCELING CHARACTERISTICS
- Publication number 20170084395
- Publication date Mar 23, 2017
- Apple Inc.
- Paul A. MARTINEZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SURFACE SHAPING OF DEVICE PACKAGES TO MITIGATE FRACTURES UNDER BEND...
- Publication number 20170083042
- Publication date Mar 23, 2017
- Apple Inc.
- Shawn X. ARNOLD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed Circuits With Embedded Strain Gauges
- Publication number 20170030784
- Publication date Feb 2, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20160267313
- Publication date Sep 15, 2016
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20160004896
- Publication date Jan 7, 2016
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CERAMIC CAPACITORS WITH BUILT-IN EMI SHIELD
- Publication number 20150364255
- Publication date Dec 17, 2015
- Apple Inc.
- Gang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEEL FILLET CAPACITOR WITH NOISE REDUCTION
- Publication number 20150364253
- Publication date Dec 17, 2015
- Apple Inc.
- Shawn X. Arnold
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
MULTI-LAYERED CERAMIC CAPACITORS
- Publication number 20150310991
- Publication date Oct 29, 2015
- Apple Inc.
- Gang NING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20150242675
- Publication date Aug 27, 2015
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR FORMING A SENSOR ARRAY PACKAGE
- Publication number 20150230339
- Publication date Aug 13, 2015
- Apple Inc.
- Shawn X. Arnold
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20140227833
- Publication date Aug 14, 2014
- Apple Inc.
- Shawn X. Arnold
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Capacitive Sensor Packaging
- Publication number 20140216914
- Publication date Aug 7, 2014
- Apple Inc.
- Benjamin J. Pope
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW ACOUSTIC NOISE CAPACITORS
- Publication number 20140218841
- Publication date Aug 7, 2014
- Apple Inc.
- Gang NING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN...
- Publication number 20140218155
- Publication date Aug 7, 2014
- Apple Inc.
- Sunil M. Akre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST REPACKAGING OF THINNED INTEGRATED DEVICES
- Publication number 20140159214
- Publication date Jun 12, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...
- Publication number 20140134760
- Publication date May 15, 2014
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SHAPING
- Publication number 20140091439
- Publication date Apr 3, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE TH...
- Publication number 20140085851
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY
- Publication number 20140084454
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIMETER TRENCH SENSOR ARRAY PACKAGE
- Publication number 20140084425
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS

Shawn X. ARNOLD

Person

Patents Grantslast 30 patents

Low profile packaging and assembly of a power conversion system in...

Capacitive sensor packaging

Connection pad for embedded components in PCB packaging

Capacitive sensor packaging

Segmented via for vertical PCB interconnect

Capacitor structure with acoustic noise self-canceling characteristics

Capacitive sensor packaging

Capacitive sensor packaging

Low profile packaging and assembly of a power conversion system in...

Techniques for observing an entire communication bus in operation

Acoustically quiet capacitors

Techniques for observing an entire communication bus in operation

Ceramic capacitors with built-in EMI shield

Electronic devices with magnetic sensors

Printed circuits with embedded strain gauges

Capacitive sensor packaging

Connector having printed circuit with embedded die

Printed circuits with embedded semiconductor dies

Methods for forming a sensor array package

Low cost repackaging of thinned integrated devices

Low acoustic noise capacitors

Capacitive sensor packaging

Small form factor stacked electrical passive devices that reduce th...

Antenna structures and shield layers on packaged wireless circuits

Perimeter trench sensor array package

Capacitive sensor packaging

Direct multiple substrate die assembly

Silicon shaping

Capacitive sensor packaging

Low profile, space efficient circuit shields

Patents Applicationslast 30 patents

Capacitive Sensor Packaging

SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT

Capacitive Sensor Packaging

LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN...

MULTI-LAYERED CERAMIC CAPACITORS

STACKED PASSIVE COMPONENT STRUCTURES

Capacitive Sensor Packaging

TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION

TECHNIQUES FOR OBSERVING AN ENTIRE COMMUNICATION BUS IN OPERATION

Capacitive Sensor Packaging

CAPACITOR STRUCTURE WITH ACOUSTIC NOISE SELF-CANCELING CHARACTERISTICS

SURFACE SHAPING OF DEVICE PACKAGES TO MITIGATE FRACTURES UNDER BEND...

Printed Circuits With Embedded Strain Gauges

Capacitive Sensor Packaging

Capacitive Sensor Packaging

CERAMIC CAPACITORS WITH BUILT-IN EMI SHIELD

HEEL FILLET CAPACITOR WITH NOISE REDUCTION

MULTI-LAYERED CERAMIC CAPACITORS

Capacitive Sensor Packaging

METHODS FOR FORMING A SENSOR ARRAY PACKAGE

SENSOR ARRAY PACKAGE

Capacitive Sensor Packaging

LOW ACOUSTIC NOISE CAPACITORS

LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN...

LOW COST REPACKAGING OF THINNED INTEGRATED DEVICES

DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...

SILICON SHAPING

SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE TH...

DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY

PERIMETER TRENCH SENSOR ARRAY PACKAGE