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Shawna M. Liff
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Scottsdale, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,967,580
Issue date
Apr 23, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,916,020
Issue date
Feb 27, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having an integrated voltage regulator c...
Patent number
11,916,006
Issue date
Feb 27, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,901,330
Issue date
Feb 13, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging with high density interconnects
Patent number
11,881,457
Issue date
Jan 23, 2024
Tahoe Research, LTD.
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna package using ball attach array to connect antenna and base...
Patent number
11,870,163
Issue date
Jan 9, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a modular side radiating waveguide...
Patent number
11,830,831
Issue date
Nov 28, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
11,824,018
Issue date
Nov 21, 2023
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,791,277
Issue date
Oct 17, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,769,751
Issue date
Sep 26, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,756,943
Issue date
Sep 12, 2023
Intel Corporation
Shawna M. Liff
G02 - OPTICS
Information
Patent Grant
Composite IC chips including a chiplet embedded within metallizatio...
Patent number
11,749,649
Issue date
Sep 5, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies with communication networks
Patent number
11,749,642
Issue date
Sep 5, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
11,735,533
Issue date
Aug 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligned core balls for interconnect joint stability
Patent number
11,735,551
Issue date
Aug 22, 2023
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,721,649
Issue date
Aug 8, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vias in composite IC chip structures
Patent number
11,694,986
Issue date
Jul 4, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly that includes a bridge
Patent number
11,676,900
Issue date
Jun 13, 2023
Intel Corporation
Eric J. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure fabrication using grayscale lithography
Patent number
11,664,303
Issue date
May 30, 2023
Intel Corporation
Johanna Swan
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Microelectronic assemblies
Patent number
11,616,047
Issue date
Mar 28, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with radio frequency (RF) chiplet
Patent number
11,605,603
Issue date
Mar 14, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,600,594
Issue date
Mar 7, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreading layer integrated within a composite IC die structure...
Patent number
11,581,238
Issue date
Feb 14, 2023
Intel Corporation
Shawna Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Serializer-deserializer die for high speed signal interconnect
Patent number
11,581,282
Issue date
Feb 14, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Superconducting qubit device packages
Patent number
11,569,428
Issue date
Jan 31, 2023
Santa Clara
Jeanette M. Roberts
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Electronic package with stud bump electrical connections
Patent number
11,552,035
Issue date
Jan 10, 2023
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
Patent number
11,527,501
Issue date
Dec 13, 2022
Intel Corporation
Adel A. Elsherbini
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectronic package communication using radio interfaces connec...
Patent number
11,525,970
Issue date
Dec 13, 2022
Intel Corporation
Shawna Liff
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Microelectronic assemblies
Patent number
11,508,587
Issue date
Nov 22, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240136323
Publication date
Apr 25, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240128205
Publication date
Apr 18, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240128255
Publication date
Apr 18, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
Publication number
20240063147
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
Publication number
20240063180
Publication date
Feb 22, 2024
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
Publication number
20240063544
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240061194
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
G02 - OPTICS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063178
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
Publication number
20240063183
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
Publication number
20240063120
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
Publication number
20240063132
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
Publication number
20240063202
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
Publication number
20240063072
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
Publication number
20240063142
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
Publication number
20240063143
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES
Publication number
20240063133
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240038687
Publication date
Feb 1, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20240030116
Publication date
Jan 25, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240021534
Publication date
Jan 18, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
Publication number
20240006332
Publication date
Jan 4, 2024
Intel Corporation
Dimitrios Antartis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20230369236
Publication date
Nov 16, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Publication number
20230343716
Publication date
Oct 26, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME
Publication number
20230245972
Publication date
Aug 3, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SER...
Publication number
20230197676
Publication date
Jun 22, 2023
Intel Corporation
Gerald S. Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE FOR MODULAR DIE INTEROPERABILITY
Publication number
20230197677
Publication date
Jun 22, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER
Publication number
20230197520
Publication date
Jun 22, 2023
Intel Corporation
Yi SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...
Publication number
20230187362
Publication date
Jun 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE
Publication number
20230187407
Publication date
Jun 15, 2023
Intel Corporation
Carleton L. Molnar
H01 - BASIC ELECTRIC ELEMENTS