Shee Min YEONG

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of packaging integrated circuits
- Patent number 8,030,138
- Issue date Oct 4, 2011
- National Semiconductor Corporation
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated heat sink
- Patent number 8,018,050
- Issue date Sep 13, 2011
- National Semiconductor Corporation
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel level methods and systems for packaging integrated circuits w...
- Patent number 7,998,791
- Issue date Aug 16, 2011
- National Semiconductor Corporation
- Sek Hoi Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress cavity package
- Patent number 7,868,433
- Issue date Jan 11, 2011
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for packaging integrated circuits
- Patent number 7,863,757
- Issue date Jan 4, 2011
- National Semiconductor Corporation
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for packaging integrated circuits
- Patent number 7,749,809
- Issue date Jul 6, 2010
- National Semiconductor Corporation
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical leadless leadframe package
- Patent number 7,582,954
- Issue date Sep 1, 2009
- National Semiconductor Corporation
- Peng Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20100237487
- Publication date Sep 23, 2010
- National Semiconductor Corporation
- You Chye HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS CAVITY PACKAGE
- Publication number 20100052123
- Publication date Mar 4, 2010
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL LEADLESS LEADFRAME PACKAGE
- Publication number 20090212382
- Publication date Aug 27, 2009
- National Semiconductor Corporation
- Peng Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS W...
- Publication number 20090194868
- Publication date Aug 6, 2009
- National Semiconductor Corporation
- Sek Hoi CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20090152707
- Publication date Jun 18, 2009
- National Semiconductor Corporation
- You Chye HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20090115037
- Publication date May 7, 2009
- National Semiconductor Corporation
- You Chye HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS
- Publication number 20080242003
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- You Chye HOW
- H01 - BASIC ELECTRIC ELEMENTS

Shee Min YEONG

Person

Patents Grantslast 30 patents

Methods and systems of packaging integrated circuits

Integrated circuit package with integrated heat sink

Panel level methods and systems for packaging integrated circuits w...

Low stress cavity package

Methods and systems for packaging integrated circuits

Methods and systems for packaging integrated circuits

Optical leadless leadframe package

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS

LOW STRESS CAVITY PACKAGE

OPTICAL LEADLESS LEADFRAME PACKAGE

PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS W...

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS