Sheila J. Konecke

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Leesburg, VA, US

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Patents Grantslast 30 patents

Information Patent Grant
Packaging for high-power microwave module
- Patent number 9,859,178
- Issue date Jan 2, 2018
- BAE Systems Information and Electronic Systems Integration Inc.
- Yannick C. Morel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for stacking individually tested devices to for...
- Patent number 8,697,457
- Issue date Apr 15, 2014
- BAE Systems Information and Electronic Systems Integration Inc.
- Keith K. Sturcken
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array (BGA) to column grid array (CGA) conversion process
- Patent number 6,492,254
- Issue date Dec 10, 2002
- BAE Systems Information and Electronic Systems Integration, Inc.
- Keith K. Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphite lid seal fixture
- Patent number 5,372,296
- Issue date Dec 13, 1994
- International Business Machines Corporation
- Sheila J. Konecke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING FOR HIGH-POWER MICROWAVE MODULE
- Publication number 20160100495
- Publication date Apr 7, 2016
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- YANNICK C. MOREL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS FOR STACKING INDIVIDUALLY TESTED DEVICES TO FOR...
- Publication number 20140175675
- Publication date Jun 26, 2014
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Keith K. Sturcken
- G01 - MEASURING TESTING
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20050078436
- Publication date Apr 14, 2005
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20030178715
- Publication date Sep 25, 2003
- BAE Systems
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array (BGA) to column grid array (CGA) conversion process
- Publication number 20020102767
- Publication date Aug 1, 2002
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS